Dell products l.p. (20240138090). MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS simplified abstract
Contents
- 1 MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional data center cooling systems in terms of energy efficiency?
- 1.11 What are the potential challenges in implementing this modular data center technology on a large scale?
- 1.12 Original Abstract Submitted
MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138090 titled 'MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS
Simplified Explanation
The abstract describes a modular data center comprising a modular information technology component (MITC) and a modular environmental control component (MECC). The MITC includes a cooling distribution unit (CDU), a floor with a floor track apparatus (FTA), a bottom CDUMC, a modular over-rack component (MORC), and a top CDUMC. The MECC includes a plurality of environmental control components (ECCs) and built-in airflow connection components.
- Modular data center with MITC and MECC components
- MITC includes CDU, FTA, CDUMC, MORC, and top CDUMC
- MECC includes ECCs and built-in airflow connection components
Potential Applications
The modular data center technology can be applied in various industries such as telecommunications, cloud computing, and data storage facilities.
Problems Solved
This technology solves the problem of efficiently cooling and controlling the environment within a data center while allowing for modular and scalable expansion.
Benefits
The benefits of this technology include improved energy efficiency, easier maintenance, scalability, and flexibility in data center design and deployment.
Potential Commercial Applications
The technology can be commercially applied in building new data centers, upgrading existing facilities, and providing modular data center solutions to businesses of all sizes.
Possible Prior Art
One possible prior art could be traditional data center cooling systems that are not as modular or efficient as the described technology.
Unanswered Questions
How does this technology compare to traditional data center cooling systems in terms of energy efficiency?
The article does not provide a direct comparison between this modular data center technology and traditional data center cooling systems in terms of energy efficiency. It would be interesting to see a study or analysis on the energy savings potential of this innovation compared to traditional systems.
What are the potential challenges in implementing this modular data center technology on a large scale?
The article does not address the potential challenges that may arise when implementing this modular data center technology on a large scale. It would be beneficial to explore the logistical, financial, and technical obstacles that could be encountered when deploying this innovation in a real-world setting.
Original Abstract Submitted
a modular data center includes: a modular information technology component (mitc), in which the mitc comprises a cooling distribution unit (cdu), a floor, a bottom cooling distribution unit mounting component (cdumc), a modular over-rack component (morc), and a top cdumc, in which the floor comprises a floor track apparatus (fta), in which the bottom cdumc affixes the cdu to the fta, in which the top cdumc affixes the cdu to the morc, in which the top cdumc provides air containment with an internal environment of the mitc; and a modular environmental control component (mecc), in which the mecc comprises a plurality of environmental control components (eccs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the mitc.
