Dell products l.p. (20240138082). SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS simplified abstract
Contents
- 1 SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS
Organization Name
Inventor(s)
JULIAN YU-HAO Chen of Austin TX (US)
HUNG-JEN Chen of Taoyuan City (TW)
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138082 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF REMOVABLE COMPONENTS
Simplified Explanation
The patent application describes methods, systems, and devices for providing computer-implemented services by modifying the quantity of hardware resources available through the addition of removable cards to a host system. The host system can selectively warm the removable cards through conduction heating while they are cold to maintain their temperatures within operating ranges.
- Explanation:
- Computer-implemented services are provided by modifying hardware resources.
- Quantity of hardware resources is adjusted by adding removable cards to a host system.
- Host system can warm removable cards through conduction heating while cold.
Potential Applications
The technology described in the patent application could be applied in various industries such as data centers, cloud computing, and high-performance computing where the efficient management of hardware resources is crucial.
Problems Solved
This technology solves the problem of efficiently modifying hardware resources for providing computer-implemented services without the need for complex and time-consuming processes.
Benefits
The benefits of this technology include improved flexibility in managing hardware resources, increased efficiency in providing computer-implemented services, and cost-effectiveness in scaling hardware resources as needed.
Potential Commercial Applications
Optimizing Hardware Resources for Computer-Implemented Services
Possible Prior Art
There may be prior art related to the modification of hardware resources for computer-implemented services through the use of removable cards, but further research is needed to identify specific examples.
Unanswered Questions
How does the conduction heating process affect the performance and longevity of the removable cards?
The conduction heating process described in the patent application may raise questions about the impact on the performance and longevity of the removable cards. Further research and testing would be needed to determine the effects of this heating method on the overall functionality and lifespan of the hardware components.
Are there any potential safety concerns associated with selectively warming removable cards through conduction heating?
The use of conduction heating to warm removable cards in a host system may raise concerns about safety risks such as overheating or damage to the hardware components. It would be important to address these potential safety concerns through proper design and testing to ensure the reliability and safety of the system.
Original Abstract Submitted
methods, systems, and devices for providing computer implemented services are disclosed. to provide the computer implemented services, the quantity of hardware resources available for providing the computer implemented services may be modified. the quantity of hardware resources may be modified by adding removable cards to a host system. the host system may, while the added removable cards are cold, selectively warm the removable cards through conduction heating to retain their temperatures within operating temperature ranges.
