Canon kabushiki kaisha (20240138057). FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract
Contents
- 1 FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
TOSHIYUKI Yoshida of Kanagawa (JP)
FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138057 titled 'FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
Simplified Explanation
The abstract describes a flexible wiring board with a signal line and an electroconductive layer, including a first portion with openings and a linear second portion with a connection portion at one end.
- The flexible wiring board includes a signal line and an electroconductive layer.
- The electroconductive layer has a first portion with openings and a linear second portion with a connection portion.
- The connection portion is connected to the first portion and the second portion extends towards an open end.
Potential Applications
This technology could be used in flexible electronic devices, such as wearable technology, flexible displays, and medical devices.
Problems Solved
This technology solves the problem of efficiently transmitting signals in flexible electronic devices while maintaining flexibility and durability.
Benefits
The benefits of this technology include improved signal transmission, flexibility, and durability in flexible electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology include flexible electronics manufacturing, consumer electronics, healthcare devices, and automotive electronics.
Possible Prior Art
One possible prior art could be flexible circuit boards with signal lines and conductive layers, but the specific design described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing flexible wiring board designs?
Answer: This article does not provide a direct comparison to existing designs, so it is unclear how this technology differs or improves upon current solutions.
What materials are used in the construction of this flexible wiring board?
Answer: The abstract does not specify the materials used in the construction of the flexible wiring board, leaving this aspect unanswered.
Original Abstract Submitted
a flexible wiring board includes a signal line that transmits a signal and an electroconductive layer that is disposed to face the signal line, wherein the electroconductive layer includes a first portion in which a plurality of openings are provided, and a linear second portion that is formed in at least one of the plurality of openings, that has, at one end thereof, a connection portion connected to the first portion, and whose other end is an open end, where the connection portion is disposed in the second portion on a sending side in a transmission direction of a signal through the signal line. an angle between a direction along the transmission direction of the signal and an extension direction of the second portion from the connection portion toward the open end is an acute angle or an obtuse angle.
