Canon kabushiki kaisha (20240109323). LIQUID EJECTION HEAD AND RECORDING APPARATUS simplified abstract
Contents
- 1 LIQUID EJECTION HEAD AND RECORDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIQUID EJECTION HEAD AND RECORDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LIQUID EJECTION HEAD AND RECORDING APPARATUS
Organization Name
Inventor(s)
TAKAHITO Kido of Kanagawa (JP)
LIQUID EJECTION HEAD AND RECORDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240109323 titled 'LIQUID EJECTION HEAD AND RECORDING APPARATUS
Simplified Explanation
The liquid ejection head described in the patent application includes a base substrate with a flow passage for liquid, chips for ejecting the liquid, and a cover member with sealing resin applied to gaps between the chips and the cover member, where the gaps have non-uniform distances and are each provided with a protrusion.
- Base substrate with flow passage for liquid
- Chips for ejecting liquid
- Cover member with sealing resin applied to gaps between chips and cover member
- Non-uniform distances of gaps between chips and cover member
- Protrusions provided in each gap
Potential Applications
The technology described in the patent application could be applied in various industries such as:
- Inkjet printing
- 3D printing
- Biomedical devices
- Microfluidics
Problems Solved
This technology addresses the following issues:
- Leakage of liquid from gaps between chips and cover member
- Inconsistent distances between chips and cover member
- Ensuring proper sealing of the liquid ejection head
Benefits
The benefits of this technology include:
- Improved precision and accuracy in liquid ejection
- Enhanced reliability and durability of the ejection head
- Reduced maintenance and downtime due to leakage issues
Potential Commercial Applications
The technology could be commercially applied in:
- Printer manufacturing
- Medical device production
- Laboratory equipment development
- Consumer electronics manufacturing
Possible Prior Art
One possible prior art for this technology could be the use of sealing resins in electronic components to prevent leakage and improve performance.
Unanswered Questions
How does the non-uniform distance of the gaps between the chips and cover member affect the overall performance of the liquid ejection head?
The non-uniform distance of the gaps could impact the consistency of liquid ejection and the effectiveness of the sealing resin. Further research is needed to understand the specific implications of this design feature.
What materials are commonly used for the protrusions in the gaps between the chips and cover member?
The patent application does not specify the materials used for the protrusions. Investigating the most suitable materials for this component could provide insights into optimizing the design for better performance and longevity.
Original Abstract Submitted
there is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion.
