Canon kabushiki kaisha (20240109320). LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
- 1 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
TOMOAKI Kamagata of Kanagawa (JP)
TAKASHI Hayasaka of Kanagawa (JP)
SATOSHI Ideta of Kanagawa (JP)
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240109320 titled 'LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The liquid ejection head described in the patent application consists of an element substrate, an electric wiring board, a cover member, and a support member with specific features and functions.
- The element substrate contains an ejection port and a pressure chamber for liquid supply.
- The cover member is attached to the support surface of the support member using a first adhesive.
- The support member holds the element substrate and electric wiring board in place on the support surface.
- The first through hole acts as a passage for liquid to enter the pressure chamber, while the second through hole opens in the support surface.
- The first adhesive is placed in the outer peripheral region of the support surface, creating a space that connects with the second through hole.
Potential Applications
The technology described in this patent application could be applied in inkjet printers, 3D printing, and other liquid ejection systems.
Problems Solved
This technology solves the problem of efficiently supplying liquid to an ejection port while maintaining structural integrity and preventing leakage.
Benefits
The benefits of this technology include improved liquid ejection performance, reduced risk of leakage, and enhanced overall reliability of liquid ejection systems.
Potential Commercial Applications
The potential commercial applications of this technology include manufacturing inkjet printers, industrial printing systems, and medical devices that require precise liquid ejection capabilities.
Possible Prior Art
One possible prior art for this technology could be similar liquid ejection heads used in existing inkjet printers or industrial printing systems.
Unanswered Questions
How does this technology compare to existing liquid ejection systems in terms of efficiency and reliability?
This article does not provide a direct comparison between this technology and existing liquid ejection systems. Further research or testing may be needed to determine the specific advantages of this innovation over current systems.
What materials are used in the construction of the liquid ejection head and how do they impact its performance?
The article does not specify the materials used in the construction of the liquid ejection head or how they may affect its performance. Understanding the materials and their properties could provide valuable insights into the functionality and durability of the technology.
Original Abstract Submitted
a liquid ejection head includes an element substrate, an electric wiring board, a cover member, and a support member having a first through hole, a second through hole, and a support surface. the element substrate includes an ejection port and a pressure chamber to supply liquid to the ejection port. the cover member is joined to the support surface with a first adhesive. the support member supports the element substrate and the electric wiring board on the support surface. the first through hole serves as a flow passage through which the liquid is supplied to the pressure chamber and the second through hole opens in the support surface. the first adhesive is disposed in an outer peripheral region of the support surface of the support member. a space surrounded by the cover member, the support member, and the first adhesive communicates with the second through hole.
