Canon kabushiki kaisha (20240105643). CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS simplified abstract
Contents
- 1 CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS
Organization Name
Inventor(s)
CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105643 titled 'CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS
Simplified Explanation
The abstract describes a circuit board where either a first semiconductor device or a second semiconductor device, different from the first one, can be exclusively mounted. The circuit board includes a region where a component necessary for a function in the first semiconductor device but not in the second one can be mounted. The component is prevented from being mounted in this region when the first semiconductor device is used, but it is mounted when the second semiconductor device is used.
- Circuit board allows exclusive mounting of different semiconductor devices.
- Includes a region for mounting components specific to the first semiconductor device.
- Prevents mounting of certain components based on the semiconductor device used.
Potential Applications
This technology can be applied in various electronic devices where different semiconductor devices with specific functions need to be mounted on the same circuit board.
Problems Solved
1. Efficient use of circuit boards by accommodating different semiconductor devices. 2. Ensuring proper functionality by preventing mounting of incompatible components.
Benefits
1. Versatility in designing electronic devices. 2. Cost-effective solution for incorporating multiple semiconductor devices.
Potential Commercial Applications
- "Versatile Circuit Board Technology for Multiple Semiconductor Devices"
Possible Prior Art
There may be existing patents or technologies related to circuit boards with specific regions for mounting components based on the semiconductor device used. Further research is needed to identify any prior art in this specific area.
Unanswered Questions
How does the circuit board determine which semiconductor device is mounted?
The abstract does not mention the mechanism by which the circuit board identifies and differentiates between the first and second semiconductor devices.
Are there any limitations to the types of semiconductor devices that can be mounted on the circuit board?
It is unclear from the abstract if there are any restrictions on the compatibility of semiconductor devices that can be exclusively mounted on the circuit board.
Original Abstract Submitted
a circuit board on which a first semiconductor device or a second semiconductor device which is different from the first semiconductor device is exclusively mounted, wherein the circuit board comprises a region in which a component configured to form a circuit for achieving a function incorporated in the first semiconductor device but not incorporated in the second semiconductor device is to be mounted, and wherein the component is prevented from being mounted in the region in a case where the first semiconductor device is mounted, and the component is mounted in the region in a case where the second semiconductor device is mounted.
