Difference between revisions of "CHANGXIN MEMORY TECHNOLOGIES, INC. patent applications published on November 30th, 2023"
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==Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023== | ==Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023== | ||
− | ===PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE ([[US Patent Application 17951625. PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE simplified abstract|17951625]])=== | + | ===PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE ([[US Patent Application 17951625. PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17951625]])=== |
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− | ===METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT ([[US Patent Application 17872479. METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT simplified abstract|17872479]])=== | + | ===METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT ([[US Patent Application 17872479. METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17872479]])=== |
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− | ===DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448891. DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY simplified abstract|18448891]])=== | + | ===DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448891. DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448891]])=== |
Line 25: | Line 25: | ||
− | ===METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM ([[US Patent Application 17899056. METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM simplified abstract|17899056]])=== | + | ===METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM ([[US Patent Application 17899056. METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17899056]])=== |
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− | ===METHOD AND APPARATUS FOR CHECKING SIGNAL LINE ([[US Patent Application 17898727. METHOD AND APPARATUS FOR CHECKING SIGNAL LINE simplified abstract|17898727]])=== | + | ===METHOD AND APPARATUS FOR CHECKING SIGNAL LINE ([[US Patent Application 17898727. METHOD AND APPARATUS FOR CHECKING SIGNAL LINE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17898727]])=== |
Line 41: | Line 41: | ||
− | ===TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18169159. TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY simplified abstract|18169159]])=== | + | ===TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18169159. TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18169159]])=== |
Line 49: | Line 49: | ||
− | ===REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE ([[US Patent Application 18332706. REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE simplified abstract|18332706]])=== | + | ===REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE ([[US Patent Application 18332706. REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18332706]])=== |
Line 57: | Line 57: | ||
− | ===REFRESH ADDRESS GENERATION CIRCUIT ([[US Patent Application 18153312. REFRESH ADDRESS GENERATION CIRCUIT simplified abstract|18153312]])=== | + | ===REFRESH ADDRESS GENERATION CIRCUIT ([[US Patent Application 18153312. REFRESH ADDRESS GENERATION CIRCUIT simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18153312]])=== |
Line 65: | Line 65: | ||
− | ===REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD ([[US Patent Application 18157558. REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD simplified abstract|18157558]])=== | + | ===REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD ([[US Patent Application 18157558. REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18157558]])=== |
Line 73: | Line 73: | ||
− | ===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18449060. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract|18449060]])=== | + | ===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18449060. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18449060]])=== |
Line 81: | Line 81: | ||
− | ===POWER SUPPLY SWITCHING CIRCUIT AND MEMORY ([[US Patent Application 18327062. POWER SUPPLY SWITCHING CIRCUIT AND MEMORY simplified abstract|18327062]])=== | + | ===POWER SUPPLY SWITCHING CIRCUIT AND MEMORY ([[US Patent Application 18327062. POWER SUPPLY SWITCHING CIRCUIT AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18327062]])=== |
Line 89: | Line 89: | ||
− | ===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448897. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract|18448897]])=== | + | ===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448897. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448897]])=== |
Line 97: | Line 97: | ||
− | ===METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE ([[US Patent Application 17868774. METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE simplified abstract|17868774]])=== | + | ===METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE ([[US Patent Application 17868774. METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17868774]])=== |
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− | ===ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY ([[US Patent Application 17929747. ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY simplified abstract|17929747]])=== | + | ===ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY ([[US Patent Application 17929747. ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17929747]])=== |
Line 113: | Line 113: | ||
− | ===CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL ([[US Patent Application 18448340. CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL simplified abstract|18448340]])=== | + | ===CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL ([[US Patent Application 18448340. CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448340]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17815623. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17815623]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17815623. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17815623]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18167024]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18167024]])=== |
Line 137: | Line 137: | ||
− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17887775. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17887775]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17887775. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17887775]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18163135. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18163135]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18163135. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18163135]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF ([[US Patent Application 17878046. SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF simplified abstract|17878046]])=== | + | ===SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF ([[US Patent Application 17878046. SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17878046]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18150885. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|18150885]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18150885. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18150885]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18093779. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18093779]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18093779. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18093779]])=== |
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− | ===METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE ([[US Patent Application 18446507. METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE simplified abstract|18446507]])=== | + | ===METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE ([[US Patent Application 18446507. METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18446507]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816130. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816130]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816130. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816130]])=== |
Line 193: | Line 193: | ||
− | ===MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363901. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract|18363901]])=== | + | ===MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363901. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363901]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18446514. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract|18446514]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18446514. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18446514]])=== |
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− | ===SEMICONDUCTOR STRUCTURE ([[US Patent Application 17879913. SEMICONDUCTOR STRUCTURE simplified abstract|17879913]])=== | + | ===SEMICONDUCTOR STRUCTURE ([[US Patent Application 17879913. SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17879913]])=== |
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− | ===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816156. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|17816156]])=== | + | ===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816156. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816156]])=== |
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− | ===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816435. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|17816435]])=== | + | ===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816435. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816435]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816436. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816436]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816436. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816436]])=== |
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− | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 17929842. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract|17929842]])=== | + | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 17929842. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17929842]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17813409. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17813409]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17813409. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17813409]])=== |
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− | ===MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 17885727. MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract|17885727]])=== | + | ===MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 17885727. MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17885727]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 18151360. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract|18151360]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 18151360. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18151360]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME ([[US Patent Application 17899684. SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract|17899684]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME ([[US Patent Application 17899684. SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17899684]])=== |
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− | ===TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 18151434. TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|18151434]])=== | + | ===TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 18151434. TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18151434]])=== |
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− | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363819. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract|18363819]])=== | + | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363819. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363819]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816438. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816438]])=== | + | ===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816438. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816438]])=== |
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− | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 18363833. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract|18363833]])=== | + | ===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 18363833. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363833]])=== |
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− | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME ([[US Patent Application 18169839. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract|18169839]])=== | + | ===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME ([[US Patent Application 18169839. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18169839]])=== |
Revision as of 07:02, 5 December 2023
Contents
- 1 Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023
- 1.1 PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE (17951625)
- 1.2 METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT (17872479)
- 1.3 DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY (18448891)
- 1.4 METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM (17899056)
- 1.5 METHOD AND APPARATUS FOR CHECKING SIGNAL LINE (17898727)
- 1.6 TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY (18169159)
- 1.7 REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE (18332706)
- 1.8 REFRESH ADDRESS GENERATION CIRCUIT (18153312)
- 1.9 REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD (18157558)
- 1.10 SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18449060)
- 1.11 POWER SUPPLY SWITCHING CIRCUIT AND MEMORY (18327062)
- 1.12 SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18448897)
- 1.13 METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE (17868774)
- 1.14 ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY (17929747)
- 1.15 CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL (18448340)
- 1.16 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17815623)
- 1.17 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18167024)
- 1.18 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17887775)
- 1.19 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18163135)
- 1.20 SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF (17878046)
- 1.21 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18150885)
- 1.22 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18093779)
- 1.23 METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE (18446507)
- 1.24 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816130)
- 1.25 MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY (18363901)
- 1.26 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (18446514)
- 1.27 SEMICONDUCTOR STRUCTURE (17879913)
- 1.28 TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY (17816156)
- 1.29 TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY (17816435)
- 1.30 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816436)
- 1.31 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE (17929842)
- 1.32 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17813409)
- 1.33 MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME (17885727)
- 1.34 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME (18151360)
- 1.35 SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME (17899684)
- 1.36 TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY (18151434)
- 1.37 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY (18363819)
- 1.38 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816438)
- 1.39 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE (18363833)
- 1.40 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18169839)
Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023
PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE (17951625)
Main Inventor
Honglong SHI
METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT (17872479)
Main Inventor
Zengquan WU
DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY (18448891)
Main Inventor
Yinchuan GU
METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM (17899056)
Main Inventor
Yu LI
METHOD AND APPARATUS FOR CHECKING SIGNAL LINE (17898727)
Main Inventor
Min MIN
TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY (18169159)
Main Inventor
Kangling JI
REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE (18332706)
Main Inventor
Yinchuan GU
REFRESH ADDRESS GENERATION CIRCUIT (18153312)
Main Inventor
Yinchuan GU
REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD (18157558)
Main Inventor
Liang ZHANG
SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18449060)
Main Inventor
Zequn HUANG
POWER SUPPLY SWITCHING CIRCUIT AND MEMORY (18327062)
Main Inventor
Yupeng FAN
SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18448897)
Main Inventor
Zequn HUANG
METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE (17868774)
Main Inventor
Xikun CHU
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