Difference between revisions of "CHANGXIN MEMORY TECHNOLOGIES, INC. patent applications published on November 30th, 2023"

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==Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023==
 
==Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023==
  
===PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE ([[US Patent Application 17951625. PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE simplified abstract|17951625]])===
+
===PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE ([[US Patent Application 17951625. PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17951625]])===
  
  
Line 9: Line 9:
  
  
===METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT ([[US Patent Application 17872479. METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT simplified abstract|17872479]])===
+
===METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT ([[US Patent Application 17872479. METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17872479]])===
  
  
Line 17: Line 17:
  
  
===DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448891. DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY simplified abstract|18448891]])===
+
===DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448891. DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448891]])===
  
  
Line 25: Line 25:
  
  
===METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM ([[US Patent Application 17899056. METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM simplified abstract|17899056]])===
+
===METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM ([[US Patent Application 17899056. METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17899056]])===
  
  
Line 33: Line 33:
  
  
===METHOD AND APPARATUS FOR CHECKING SIGNAL LINE ([[US Patent Application 17898727. METHOD AND APPARATUS FOR CHECKING SIGNAL LINE simplified abstract|17898727]])===
+
===METHOD AND APPARATUS FOR CHECKING SIGNAL LINE ([[US Patent Application 17898727. METHOD AND APPARATUS FOR CHECKING SIGNAL LINE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17898727]])===
  
  
Line 41: Line 41:
  
  
===TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18169159. TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY simplified abstract|18169159]])===
+
===TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY ([[US Patent Application 18169159. TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18169159]])===
  
  
Line 49: Line 49:
  
  
===REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE ([[US Patent Application 18332706. REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE simplified abstract|18332706]])===
+
===REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE ([[US Patent Application 18332706. REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18332706]])===
  
  
Line 57: Line 57:
  
  
===REFRESH ADDRESS GENERATION CIRCUIT ([[US Patent Application 18153312. REFRESH ADDRESS GENERATION CIRCUIT simplified abstract|18153312]])===
+
===REFRESH ADDRESS GENERATION CIRCUIT ([[US Patent Application 18153312. REFRESH ADDRESS GENERATION CIRCUIT simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18153312]])===
  
  
Line 65: Line 65:
  
  
===REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD ([[US Patent Application 18157558. REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD simplified abstract|18157558]])===
+
===REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD ([[US Patent Application 18157558. REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18157558]])===
  
  
Line 73: Line 73:
  
  
===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18449060. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract|18449060]])===
+
===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18449060. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18449060]])===
  
  
Line 81: Line 81:
  
  
===POWER SUPPLY SWITCHING CIRCUIT AND MEMORY ([[US Patent Application 18327062. POWER SUPPLY SWITCHING CIRCUIT AND MEMORY simplified abstract|18327062]])===
+
===POWER SUPPLY SWITCHING CIRCUIT AND MEMORY ([[US Patent Application 18327062. POWER SUPPLY SWITCHING CIRCUIT AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18327062]])===
  
  
Line 89: Line 89:
  
  
===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448897. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract|18448897]])===
+
===SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY ([[US Patent Application 18448897. SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448897]])===
  
  
Line 97: Line 97:
  
  
===METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE ([[US Patent Application 17868774. METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE simplified abstract|17868774]])===
+
===METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE ([[US Patent Application 17868774. METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17868774]])===
  
  
Line 105: Line 105:
  
  
===ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY ([[US Patent Application 17929747. ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY simplified abstract|17929747]])===
+
===ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY ([[US Patent Application 17929747. ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17929747]])===
  
  
Line 113: Line 113:
  
  
===CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL ([[US Patent Application 18448340. CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL simplified abstract|18448340]])===
+
===CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL ([[US Patent Application 18448340. CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18448340]])===
  
  
Line 121: Line 121:
  
  
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17815623. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17815623]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17815623. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17815623]])===
  
  
Line 129: Line 129:
  
  
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18167024]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18167024]])===
  
  
Line 137: Line 137:
  
  
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17887775. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17887775]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17887775. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17887775]])===
  
  
Line 145: Line 145:
  
  
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18163135. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18163135]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18163135. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18163135]])===
  
  
Line 153: Line 153:
  
  
===SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF ([[US Patent Application 17878046. SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF simplified abstract|17878046]])===
+
===SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF ([[US Patent Application 17878046. SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17878046]])===
  
  
Line 161: Line 161:
  
  
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18150885. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|18150885]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18150885. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18150885]])===
  
  
Line 169: Line 169:
  
  
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18093779. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract|18093779]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18093779. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18093779]])===
  
  
Line 177: Line 177:
  
  
===METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE ([[US Patent Application 18446507. METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE simplified abstract|18446507]])===
+
===METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE ([[US Patent Application 18446507. METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18446507]])===
  
  
Line 185: Line 185:
  
  
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816130. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816130]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816130. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816130]])===
  
  
Line 193: Line 193:
  
  
===MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363901. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract|18363901]])===
+
===MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363901. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363901]])===
  
  
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===SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18446514. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract|18446514]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE ([[US Patent Application 18446514. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18446514]])===
  
  
Line 209: Line 209:
  
  
===SEMICONDUCTOR STRUCTURE ([[US Patent Application 17879913. SEMICONDUCTOR STRUCTURE simplified abstract|17879913]])===
+
===SEMICONDUCTOR STRUCTURE ([[US Patent Application 17879913. SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17879913]])===
  
  
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===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816156. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|17816156]])===
+
===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816156. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816156]])===
  
  
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===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816435. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|17816435]])===
+
===TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 17816435. TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816435]])===
  
  
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===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816436. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816436]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816436. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816436]])===
  
  
Line 241: Line 241:
  
  
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 17929842. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract|17929842]])===
+
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 17929842. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17929842]])===
  
  
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===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17813409. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17813409]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17813409. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17813409]])===
  
  
Line 257: Line 257:
  
  
===MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 17885727. MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract|17885727]])===
+
===MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 17885727. MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17885727]])===
  
  
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===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 18151360. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract|18151360]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME ([[US Patent Application 18151360. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18151360]])===
  
  
Line 273: Line 273:
  
  
===SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME ([[US Patent Application 17899684. SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract|17899684]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME ([[US Patent Application 17899684. SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17899684]])===
  
  
Line 281: Line 281:
  
  
===TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 18151434. TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract|18151434]])===
+
===TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY ([[US Patent Application 18151434. TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18151434]])===
  
  
Line 289: Line 289:
  
  
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363819. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract|18363819]])===
+
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY ([[US Patent Application 18363819. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363819]])===
  
  
Line 297: Line 297:
  
  
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816438. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract|17816438]])===
+
===SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 17816438. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|17816438]])===
  
  
Line 305: Line 305:
  
  
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 18363833. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract|18363833]])===
+
===METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE ([[US Patent Application 18363833. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18363833]])===
  
  
Line 313: Line 313:
  
  
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME ([[US Patent Application 18169839. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract|18169839]])===
+
===SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME ([[US Patent Application 18169839. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)|18169839]])===
  
  

Revision as of 07:02, 5 December 2023

Contents

Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on November 30th, 2023

PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE (17951625)

Main Inventor

Honglong SHI


METHOD AND DEVICE FOR EVALUATING PERFORMANCE OF SEQUENTIAL LOGIC ELEMENT (17872479)

Main Inventor

Zengquan WU


DATA PROCESSING CIRCUITRY AND METHOD, AND SEMICONDUCTOR MEMORY (18448891)

Main Inventor

Yinchuan GU


METHOD AND APPARATUS FOR TESTING COMMAND, TEST PLATFORM, AND READABLE STORAGE MEDIUM (17899056)

Main Inventor

Yu LI


METHOD AND APPARATUS FOR CHECKING SIGNAL LINE (17898727)

Main Inventor

Min MIN


TIMING SEQUENCE CONTROL CIRCUIT, TIMING SEQUENCE CONTROL METHOD, AND SEMICONDUCTOR MEMORY (18169159)

Main Inventor

Kangling JI


REFRESH ADDRESS GENERATION CIRCUIT AND METHOD, MEMORY, AND ELECTRONIC DEVICE (18332706)

Main Inventor

Yinchuan GU


REFRESH ADDRESS GENERATION CIRCUIT (18153312)

Main Inventor

Yinchuan GU


REFRESH CONTROL CIRCUIT, MEMORY, AND REFRESH CONTROL METHOD (18157558)

Main Inventor

Liang ZHANG


SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18449060)

Main Inventor

Zequn HUANG


POWER SUPPLY SWITCHING CIRCUIT AND MEMORY (18327062)

Main Inventor

Yupeng FAN


SIGNAL SAMPLING CIRCUIT AND SEMICONDUCTOR MEMORY (18448897)

Main Inventor

Zequn HUANG


METHOD FOR SENSE MARGIN DETECTION FOR SENSE AMPLIFIER AND ELECTRONIC DEVICE (17868774)

Main Inventor

Xikun CHU


ANTI-FUSE STRUCTURE, ANTI-FUSE ARRAY AND MEMORY (17929747)

Main Inventor

Chuangming HOU


CIRCUIT FOR CALIBRATION CONTROL, ELECTRONIC DEVICE AND METHOD FOR CALIBRATION CONTROL (18448340)

Main Inventor

Kai TIAN


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17815623)

Main Inventor

Yi TANG


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18167024)

Main Inventor

Peimeng WANG


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17887775)

Main Inventor

Yongxiang LI


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18163135)

Main Inventor

YOUMING LIU


SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF (17878046)

Main Inventor

Xiaojie LI


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18150885)

Main Inventor

Yang CHEN


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (18093779)

Main Inventor

Xiaojie LI


METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE (18446507)

Main Inventor

Xiaoling WANG


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816130)

Main Inventor

YOUMING LIU


MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY (18363901)

Main Inventor

Yizhi ZENG


SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (18446514)

Main Inventor

Shuai GUO


SEMICONDUCTOR STRUCTURE (17879913)

Main Inventor

Jianfeng XIAO


TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY (17816156)

Main Inventor

YOUMING LIU


TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND MEMORY (17816435)

Main Inventor

YOUMING LIU


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816436)

Main Inventor

YOUMING LIU


METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE (17929842)

Main Inventor

Yi TANG


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17813409)

Main Inventor

Youming Liu


MEMORY, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME (17885727)

Main Inventor

Jingwen LU


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME (18151360)

Main Inventor

Kanyu CAO


SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME (17899684)

Main Inventor

Min LI


TRANSISTOR, MANUFACTURING METHOD THEREOF, AND MEMORY (18151434)

Main Inventor

CHUN-WEI LIAO


METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND MEMORY (18363819)

Main Inventor

Jingwen LU


SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17816438)

Main Inventor

YOUMING LIU


METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE (18363833)

Main Inventor

Jingwen LU


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18169839)

Main Inventor

Chao LIN