Apple inc. (20240107148). Camera Module Substrate Designs simplified abstract
Contents
- 1 Camera Module Substrate Designs
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Camera Module Substrate Designs - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Camera Module Substrate Designs
Organization Name
Inventor(s)
Angelo M. Alaimo of San Jose CA (US)
Wassim Ferose Habeeb Rakuman of Sammamish WA (US)
Bohan Hao of Santa Clara CA (US)
Ya-Wen Hsu of San Francisco CA (US)
Camera Module Substrate Designs - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107148 titled 'Camera Module Substrate Designs
Simplified Explanation
The abstract describes a camera module with housing elements, lens elements, an image sensor, and a substrate assembly.
- The camera module includes housing elements that define an interior cavity.
- The module has lens elements and an image sensor positioned within the cavity.
- A substrate assembly includes rigid substrates with electrical contacts on both surfaces.
- The substrate assembly is positioned partly inside the cavity and partly outside.
Potential Applications
The technology can be used in smartphones, tablets, laptops, security cameras, and other electronic devices requiring camera modules.
Problems Solved
The camera module provides a compact and efficient way to capture images and videos in electronic devices.
Benefits
The camera module offers high-quality image capture, compact design, and ease of integration into electronic devices.
Potential Commercial Applications
- "Camera Module Technology for Electronic Devices" - This technology can be applied in various consumer electronics, enhancing their camera capabilities.
Possible Prior Art
There are existing camera modules used in electronic devices, but this specific design with a substrate assembly positioned inside and outside the cavity may be a novel approach.
Unanswered Questions
How does the substrate assembly impact the overall performance of the camera module?
The article does not delve into the specific effects of the substrate assembly on the functionality and performance of the camera module.
Are there any limitations or constraints in implementing this technology in different electronic devices?
The article does not address any potential challenges or restrictions in integrating this camera module technology into various electronic devices.
Original Abstract Submitted
camera modules and associated electronic devices and systems are described. a camera module may include a set of housing elements that at least partially defines an interior cavity, a set of lens elements, an image sensor positioned within the interior cavity to receive light through the set of lens elements, and a substrate assembly. the substrate assembly may include a set of rigid substrates, a first set of electrical contacts positioned on a first surface of the set of rigid substrates, and a second set of electrical contacts positioned on a second surface of the set of rigid substrates. the substrate assembly may be positioned such that a first portion of the substrate assembly is positioned inside the interior cavity and a second portion of the substrate assembly extends outside of the interior cavity.
