Apple inc. (20240106137). CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH simplified abstract
Contents
- 1 CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH
Organization Name
Inventor(s)
James M. Jeon of Mountain House CA (US)
Mahmoud R. Amini of Sunnyvale CA (US)
Marc Soriano Baliarda of Irvine CA (US)
Tianrun Jiang of Campbell CA (US)
CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240106137 titled 'CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH
Simplified Explanation
The abstract describes a patent application for connector receptacles that provide a robust and reliable connection to a board while maintaining a small form factor. The innovation includes highly planarized solder tails with chamfered surfaces for improved soldered connections and reduced pitch between solder tails.
- Contacts with highly planarized solder tails
- Solder tails supported by extensions of housing portions for consistent placement and alignment
- Chamfered surfaces on solder tails for improved soldered connections
- Reduced pitch between solder tails for a smaller form factor
Potential Applications
The technology can be applied in various electronic devices such as smartphones, laptops, tablets, and other consumer electronics where space-saving and reliable connections are crucial.
Problems Solved
The innovation solves the problem of providing a robust and reliable connection to a board while maintaining a small form factor, ensuring consistent placement and alignment of contacts, and improving soldered connections between the receptacles and the board.
Benefits
The benefits of this technology include improved reliability of connections, space-saving design, consistent placement and alignment, and enhanced shock absorption.
Potential Commercial Applications
The technology can be commercially applied in the manufacturing of electronic devices, telecommunications equipment, automotive electronics, and industrial machinery where compact and reliable connector receptacles are required.
Possible Prior Art
One possible prior art could be connector receptacles with standard solder tails that may not provide as robust and reliable connections as the innovation described in the patent application.
Unanswered Questions
How does this technology compare to existing connector receptacles in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of implementing this technology compared to existing connector receptacles.
What are the environmental implications of using this technology in electronic devices?
The article does not address the environmental impact of using this technology in electronic devices, such as potential recycling challenges or material sustainability.
Original Abstract Submitted
connector receptacles that can provide a robust and reliable connection to a board and have a small form factor. an example can provide connector receptacles that provide a robust and reliable connection to a board by providing contacts having highly planarized solder tails. the solder tails can be supported by extensions of housing portions to provide consistent placement and alignment, as well an amount of shock absorption. the solder tails can include chamfered surfaces to improve soldered connections to pads of a board. the chamfered surfaces can also enable a reduced pitch between solder tails thereby helping to provide a reduced form factor.
