Apple inc. (20240104708). PER-OPTICAL-COMPONENT-BASED FAULT DETECTION FOR PHYSICAL COMPONENTS simplified abstract

From WikiPatents
Jump to navigation Jump to search

PER-OPTICAL-COMPONENT-BASED FAULT DETECTION FOR PHYSICAL COMPONENTS

Organization Name

apple inc.

Inventor(s)

Mikael B. Mannberg of San Jose CA (US)

Kai Zheng of Cupertino CA (US)

PER-OPTICAL-COMPONENT-BASED FAULT DETECTION FOR PHYSICAL COMPONENTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240104708 titled 'PER-OPTICAL-COMPONENT-BASED FAULT DETECTION FOR PHYSICAL COMPONENTS

Simplified Explanation

The patent application describes techniques for detecting faults in physical components using light output and image capture.

  • Detecting misalignment of physical components (e.g., cover or camera)
  • Detecting contaminants affecting data captured by a sensor (e.g., substances on or near a surface, physical changes like deformation or cracks)

Potential Applications

The technology could be applied in various industries such as manufacturing, automotive, aerospace, and healthcare for quality control and maintenance purposes.

Problems Solved

1. Efficient detection of faults in physical components 2. Improved accuracy in identifying misalignments and contaminants

Benefits

1. Increased efficiency in fault detection processes 2. Enhanced reliability of data captured by sensors 3. Cost-effective maintenance and quality control measures

Potential Commercial Applications

Optimizing quality control processes in manufacturing Enhancing safety measures in automotive and aerospace industries Improving medical imaging equipment for accurate diagnostics

Possible Prior Art

There may be prior art related to using light and image capture for fault detection in physical components, but specific examples are not provided in the abstract.

Unanswered Questions

How does the technology handle different types of contaminants on physical components?

The patent application does not specify the exact methods used to detect and differentiate between various contaminants affecting sensor data.

Are there any limitations to the size or type of physical components that can be effectively analyzed using this technique?

The abstract does not mention any restrictions or limitations regarding the size or type of components that can be inspected using the described methods.


Original Abstract Submitted

this disclosure provides more effective and/or efficient techniques for detecting faults with physical components using an example of selectively causing output of light into a cover and capturing an image of the cover to determine whether the light is visible in the image. some techniques are described herein for detecting misalignment of one or more physical components (e.g., a cover or a camera). other techniques are described herein for detecting contaminants (e.g., substances at or near a surface of a physical component and/or a physical change to the physical component, such as a deformation or a crack of the cover) affecting data captured by a sensor.