Apple inc. (20240097087). Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane simplified abstract

Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane

Organization Name

apple inc.

Inventor(s)

Justin S. Brockman of Palo Alto CA (US)

Fang Ou of San Jose CA (US)

Lina He of San Jose CA (US)

Dmitry S. Sizov of Cupertino CA (US)

Lei Zhang of Albuquerque NM (US)

Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240097087 titled 'Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane

Simplified Explanation

The abstract describes optoelectronic structures and methods of formation, including a backplane with driving circuitry and an array of contact pads, and a device layer bonded to the backplane. The device layer includes micro-sized diodes, landing pads, and a reconstituted wiring layer with via contacts connected to the landing pads. The reconstituted wiring layer is directly bonded to the array of contacts with metal-metal bonds, allowing for decoupling of the placement distribution of landing pads from the position distribution of via contacts.

• Optoelectronic structure with backplane, driving circuitry, contact pads, device layer, micro-sized diodes, landing pads, and reconstituted wiring layer.
• Direct bonding of reconstituted wiring layer with metal-metal bonds to contact pads.
• Decoupling of placement distribution of landing pads from position distribution of via contacts.

Potential Applications

This technology could be applied in:

• LED displays
• Photovoltaic cells
• Optical sensors

Problems Solved

This technology solves issues related to:

• Efficient bonding of device layers to backplanes
• Precise positioning of micro-sized components
• Simplifying wiring connections in optoelectronic structures

Benefits

The benefits of this technology include:

• Improved performance of optoelectronic devices
• Enhanced reliability and durability
• Simplified manufacturing processes

Potential Commercial Applications

Commercial applications of this technology could include:

• Consumer electronics
• Automotive lighting systems
• Medical devices

Possible Prior Art

One possible prior art could be the use of flip-chip bonding in optoelectronic devices to achieve direct connections between device layers and backplanes.

What materials are used for the metal-metal bonds in this technology?

The materials used for the metal-metal bonds in this technology are not specified in the abstract. Further details may be provided in the full patent application or related documents.

How does the decoupling of placement distribution benefit the overall performance of the optoelectronic structure?

The decoupling of placement distribution allows for more flexibility in designing and optimizing the layout of the optoelectronic structure. This can lead to improved efficiency, reliability, and performance of the device by enabling better control over the positioning of components and connections.

Original Abstract Submitted

optoelectronic structures and methods of formation are described. in an embodiment, an optoelectronic structure includes a backplane with a driving circuitry and an array of contact pads, and a device layer bonded to the backplane. the device layer may include an array of micro-sized diodes and landing pads, and a reconstituted wiring layer including an array of via contacts connected to the array of landing pads. the reconstituted wiring layer can be directly bonded with the array of contacts with metal-metal bonds. a placement distribution of the array of landing can be decoupled from a position distribution of the array of via contacts.