Apple inc. (20240096648). Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract
Contents
- 1 Seal Ring Designs Supporting Efficient Die to Die Routing
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Seal Ring Designs Supporting Efficient Die to Die Routing - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall size of the chip structure?
- 1.11 What materials are used in the split metallic seal structure?
- 1.12 Original Abstract Submitted
Seal Ring Designs Supporting Efficient Die to Die Routing
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA (US)
Chi Nung Ni of Foster City CA (US)
Long Huang of San Jose CA (US)
SivaChandra Jangam of Milpitas CA (US)
Seal Ring Designs Supporting Efficient Die to Die Routing - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096648 titled 'Seal Ring Designs Supporting Efficient Die to Die Routing
Simplified Explanation
The abstract describes chip sealing designs for die-to-die communication, including a split metallic seal structure with overlapping metallization layers and a through seal interconnect.
- Split metallic seal structure with lower and upper metallic seals
- Overlapping metallization layers
- Through seal interconnect navigating through the split metallic seal structure
Potential Applications
This technology could be applied in semiconductor manufacturing, specifically in designing chips for improved die-to-die communication.
Problems Solved
This innovation solves the challenge of enabling efficient communication between different dies within a chip structure.
Benefits
- Enhanced communication capabilities between dies - Improved overall performance of the chip structure
Potential Commercial Applications
"Enhancing Die-to-Die Communication in Semiconductor Chips"
Possible Prior Art
There may be prior art related to chip sealing designs for die-to-die communication, but specific examples are not provided in this context.
Unanswered Questions
How does this technology impact the overall size of the chip structure?
The abstract does not mention how the split metallic seal structure affects the size of the chip.
What materials are used in the split metallic seal structure?
The abstract does not specify the materials used in the split metallic seal structure for chip sealing designs.
Original Abstract Submitted
chip sealing designs to accommodate die-to-die communication are described. in an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.
