Advanced micro devices, inc. (20240114658). COMPONENT COOLER FOR A COMPUTING DEVICE simplified abstract
Contents
- 1 COMPONENT COOLER FOR A COMPUTING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPONENT COOLER FOR A COMPUTING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
COMPONENT COOLER FOR A COMPUTING DEVICE
Organization Name
Inventor(s)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
ROBERT EDWARD Radke of AUSTIN TX (US)
MUSTANSIR M. Pratapgarhwala of AUSTIN TX (US)
MICHAEL J. Austin of AUSTIN TX (US)
SUKESH Shenoy of Austin TX (US)
COMPONENT COOLER FOR A COMPUTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114658 titled 'COMPONENT COOLER FOR A COMPUTING DEVICE
Simplified Explanation
The patent application describes an apparatus for component cooling that includes multiple heat transfer paths between two heat transfer elements and a manifold with fluid passages for a heat transfer fluid.
- The apparatus includes a first heat transfer element that is thermally coupled to a heat-generating electronic component.
- There is a second heat transfer element that is part of the apparatus.
- The apparatus has a plurality of heat transfer paths that connect the first and second heat transfer elements, providing separate heat conduction paths.
- A manifold is included in the apparatus, with a first fluid passage in thermal contact with the first heat transfer element and a second fluid passage in thermal contact with the second heat transfer element.
Potential Applications
The technology described in the patent application could be used in various electronic devices such as computers, servers, and other equipment with heat-generating components that require efficient cooling systems.
Problems Solved
This technology addresses the issue of overheating in electronic components, which can lead to performance degradation and even failure. By providing an effective cooling system, the apparatus helps maintain optimal operating temperatures for the components.
Benefits
Some benefits of this technology include improved performance and reliability of electronic devices, extended lifespan of components, and potentially reduced energy consumption due to more efficient cooling.
Potential Commercial Applications
The cooling apparatus could be integrated into various electronic devices and systems, offering manufacturers a way to enhance the performance and reliability of their products while also potentially reducing maintenance costs related to overheating issues.
Possible Prior Art
One possible prior art for this technology could be existing cooling systems used in electronic devices, such as heat sinks, fans, and liquid cooling solutions. These traditional cooling methods may not offer the same level of efficiency and customization as the apparatus described in the patent application.
Unanswered Questions
How does this technology compare to other cooling solutions currently available in the market?
The article does not provide a direct comparison between this technology and other cooling solutions, leaving readers wondering about its advantages and limitations in relation to existing options.
What are the potential challenges or limitations of implementing this cooling apparatus in different types of electronic devices?
The article does not address the potential challenges or limitations that may arise when integrating this cooling apparatus into various electronic devices, leaving readers curious about the practical considerations of its implementation.
Original Abstract Submitted
an apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. the apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. the apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.
