Advanced micro devices, inc. (20240114657). COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS simplified abstract
Contents
- 1 COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS
Organization Name
Inventor(s)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
ROBERT EDWARD Radke of AUSTIN TX (US)
COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114657 titled 'COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS
Simplified Explanation
The patent application describes an apparatus for component cooling that includes multiple thermally conductive paths between two heat transfer elements, providing separate heat conduction paths from one element to the other.
- The apparatus includes a first heat transfer element thermally coupled to a heat-generating component.
- A second heat transfer element is also part of the apparatus.
- There are multiple thermally conductive paths between the first and second heat transfer elements.
- Each path provides a separate heat conduction path from the first element to the second element.
Potential Applications
The technology could be applied in various industries such as electronics, automotive, aerospace, and more for cooling components efficiently.
Problems Solved
This innovation helps in effectively cooling heat-generating components, preventing overheating and potential damage.
Benefits
- Efficient cooling of components
- Prevention of overheating
- Increased component lifespan
Potential Commercial Applications
- Electronics cooling systems
- Automotive cooling systems
- Aerospace cooling systems
Possible Prior Art
One possible prior art could be traditional cooling systems that may not have multiple thermally conductive paths for efficient heat transfer.
Unanswered Questions
How does the apparatus handle different heat levels from various components?
The patent application does not specify how the apparatus manages varying heat levels from different components and if it prioritizes cooling based on heat intensity.
What materials are used in the construction of the thermally conductive paths?
The patent application does not mention the specific materials used in the construction of the thermally conductive paths and their impact on heat conduction efficiency.
Original Abstract Submitted
an apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. the apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.
