3D Printing patent applications on 22nd Mar 2024

Patent Applications for 3D Printing on 22nd Mar 2024

Number of patent applications containing '3D Printing' or its variations: 11

3D SYSTEMS, INC. (20240091412). CURABLE COMPOUNDS AND FORMULATIONS FOR BIOMEDICAL APPLICATIONS simplified abstract

Organization: 3D SYSTEMS, INC.

Inventor(s): Pingyong Xu of Valencia CA (US) for 3D SYSTEMS, INC., Michael Brady of San Diego CA (US) for 3D SYSTEMS, INC., Jeff Banning of North Wilsonville OR (US) for 3D SYSTEMS, INC., Sarah Patty of Beaverton OR (US) for 3D SYSTEMS, INC., Peter Scott Turner of Venice CA (US) for 3D SYSTEMS, INC., Monica Keilsohn of San Diego CA (US) for 3D SYSTEMS, INC.

IPC Code(s): A61L27/52, A61L27/18, A61L27/26, B33Y80/00, C08L71/02

Velo3D, Inc. (20240091855). THREE DIMENSIONAL OBJECTS COMPRISING ROBUST ALLOYS simplified abstract

Organization: Velo3D, Inc.

Inventor(s): Kimon Symeonidis of Easton PA (US) for Velo3D, Inc., Benyamin Buller of Cupertino CA (US) for Velo3D, Inc., Tasso Lappas of Pasadena CA (US) for Velo3D, Inc.

IPC Code(s): B22F7/06, B22F10/28, B22F10/368, B22F12/90, B23K15/00, B23K15/02, B23K26/03, B23K26/342, B23K26/70, B28B1/00, B28B17/00, B33Y10/00, B33Y30/00, B33Y50/02

PERI SE (20240091983). REINFORCEMENT OF 3D-PRINTED CONCRETE BODIES simplified abstract

Organization: PERI SE

Inventor(s): Juergen Mayer of Deisenhausen (DE) for PERI SE

IPC Code(s): B28B1/00, B28B23/00, B28B23/02, B33Y70/00

City University of Hong Kong (20240092013). IN- SITU 4D PRINTING OF HIGH-TEMPERATURE MATERIALS simplified abstract

Organization: City University of Hong Kong

Inventor(s): Jian LU of Hong Kong (HK) for City University of Hong Kong, Guo LIU of Hong Kong (HK) for City University of Hong Kong

IPC Code(s): B29C64/135, B33Y10/00, B33Y80/00

Velo3D, Inc. (20240092015). THREE-DIMENSIONAL PRINTING AND THREE-DIMENSIONAL PRINTERS simplified abstract

Organization: Velo3D, Inc.

Inventor(s): Benyamin Buller of Cupertino CA (US) for Velo3D, Inc., Zachary Ryan Murphree of San Jose CA (US) for Velo3D, Inc., Richard Joseph Romano of San Jose CA (US) for Velo3D, Inc., Thomas Blasius Brezoczky of Los Gatos CA (US) for Velo3D, Inc., Alan Rick Lappen of Rio Rancho NM (US) for Velo3D, Inc., Robert Michael Martinson of Palo Alto CA (US) for Velo3D, Inc.

IPC Code(s): B29C64/153, B22F10/32, B22F12/00, B22F12/88, B22F12/90, B28B1/00, B28B17/00, B29C64/188, B29C64/20, B29C64/25, B29C64/255, B29C64/364, B29C64/371, B29C64/386, B29C64/393, B33Y30/00, B33Y40/00, B33Y40/10, B33Y40/20, B33Y50/02

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (20240092022). CONFIGURATION OF BUILD ENVELOPES simplified abstract

Organization: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor(s): Leticia RUBIO CASTILLO of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Sergio GONZALEZ MARTIN of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Jaime MACHADO NETO of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Alex CARRUESCO LLORENS of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Jordi GONZALEZ ROGEL of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Yngvar ROSSOW SETHNE of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Jordi RAVENTOS CATASUS of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

IPC Code(s): B29C64/386, B29C64/40, B33Y50/00

Velo3D, Inc. (20240092024). ARRAYS OF OPTICAL COMPONENTS IN THREE-DIMENSIONAL PRINTING simplified abstract

Organization: Velo3D, Inc.

Inventor(s): Benyamin Buller of Cupertino CA (US) for Velo3D, Inc., Alexander Vladimirovich Varlakhanov of San Carlos CA (US) for Velo3D, Inc., Joseph Andrew Tralongo of El Cajon CA (US) for Velo3D, Inc., Gregory Ferguson Brown of San Jose CA (US) for Velo3D, Inc., Sergey Korepanov of Los Altos CA (US) for Velo3D, Inc.

IPC Code(s): B29C64/386

Essentium IPCO, LLC (20240092030). 3D PRINTER SYSTEM INCLUDING G-CODE CONVERSION PROCESS AND HARDWARE ABSTRACTION LAYER simplified abstract

Organization: Essentium IPCO, LLC

Inventor(s): Omar Yasser Hegazy of Long Beach CA (US) for Essentium IPCO, LLC, Chad Eichele of Lake Forest CA (US) for Essentium IPCO, LLC, Faisal Altoukhy of Rancho Santa Margarita CA (US) for Essentium IPCO, LLC, Iris Gisey Euan Waldestrand of Puebla (MX) for Essentium IPCO, LLC, Jorge Arturo Mijares Tobias of Puebla (MX) for Essentium IPCO, LLC, Matthew Skolaut of Houston TX (US) for Essentium IPCO, LLC, William Jack MacNeish, III of Santa Ana CA (US) for Essentium IPCO, LLC

IPC Code(s): B29C64/393, B33Y50/02

OPT Industries, Inc. (20240092032). STRUCTURAL SUPPORTS FOR ADDITIVELY MANUFACTURED ARTICLES simplified abstract

Organization: OPT Industries, Inc.

Inventor(s): Kai-Hong Anthony Chu of Cambridge MA (US) for OPT Industries, Inc., Neil Grewal of Boston MA (US) for OPT Industries, Inc., Zongheng Sun of Cambridge MA (US) for OPT Industries, Inc., Jifei Ou of Medford MA (US) for OPT Industries, Inc.

IPC Code(s): B29C64/40, B29C64/393

IN-VISION Technologies AG (20240094703). 3D Printing Method simplified abstract

Organization: IN-VISION Technologies AG

Inventor(s): Wiebke JAHR of Vienna (AT) for IN-VISION Technologies AG

IPC Code(s): G05B19/4099, B29C64/124, B29C64/393, B33Y10/00, B33Y50/02

DISH Network L.L.C. (20240095312). SYSTEMS AND METHODS FOR 3D PRINTING OF LIMITED EDITION VIRTUAL ITEMS simplified abstract

Organization: DISH Network L.L.C.

Inventor(s): Eric C. Pleiman of Englewood CO (US) for DISH Network L.L.C., Jesus Flores Guerra of Englewood CO (US) for DISH Network L.L.C.

IPC Code(s): G06F21/10, B29C64/386, B33Y50/00, G06F21/44