20240014628. METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE simplified abstract (ams-OSRAM International GmbH)

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METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE

Organization Name

ams-OSRAM International GmbH

Inventor(s)

Zeljko Pajkic of Regensburg (DE)

Markus Boss of Regensburg (DE)

[[:Category:Michael M�ller of Eching (DE)|Michael M�ller of Eching (DE)]][[Category:Michael M�ller of Eching (DE)]]

METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240014628 titled 'METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE

Simplified Explanation

The abstract describes a method of manufacturing an injection molded circuit carrier, specifically focusing on the formation of an injection molded cover plate with a cavity. The cover area of the plate includes an opening, and conductive traces are formed on the top edge of the surround, side surface of the surround, and the cover area. An optical element is then formed in the opening of the cover area, and a loop-shaped interlock circuit is applied to the optical element in the edge portion between the opening and the cover area.

  • Conductive traces are formed on the cover plate, allowing for electrical connections.
  • An optical element is integrated into the cover plate, providing optical functionality.
  • A loop-shaped interlock circuit is applied to ensure secure attachment of the optical element.
  • The method involves injection molding, a common manufacturing technique for producing plastic parts.

Potential applications of this technology:

  • Manufacturing of circuit carriers for electronic devices.
  • Integration of optical elements into electronic components.
  • Creation of secure and reliable connections between optical elements and circuit carriers.

Problems solved by this technology:

  • Provides a method for integrating optical elements into injection molded circuit carriers.
  • Ensures secure attachment of the optical element using the loop-shaped interlock circuit.
  • Simplifies the manufacturing process by combining multiple steps into one.

Benefits of this technology:

  • Enables the production of compact and integrated electronic devices.
  • Improves the reliability and durability of optical connections.
  • Reduces the complexity and cost of manufacturing circuit carriers with optical functionality.


Original Abstract Submitted

in a method of manufacturing a package, in particular an injection molded circuit carrier, mid, at least one injection molded cover plate forming a cavity is provided having a cover area and a perimeter defining the cover area; wherein the cover area includes an opening. two conductive traces having a first portion on a top edge of the surround, a second portion on a side surface of the surround, and a third portion on the cover area are formed, and then an optical element is formed in the opening of the cover area. finally, a loop-shaped interlock circuit is applied to the optical element in an edge portion between the opening and the cover area, wherein one end of the loop-shaped interlock circuit is connected to each of the first and second conductive paths.

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