18546511. THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD simplified abstract (ZTE CORPORATION)
Contents
- 1 THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
Organization Name
Inventor(s)
Fengying Wang of Shenzhen (CN)
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18546511 titled 'THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
Simplified Explanation
The thermoforming device and method for a flexible printed circuit board include a first forming mechanism with a first forming portion, a second forming mechanism with a second forming portion, heating modules for heat treatment, driving mechanisms for displacement, and a controller.
- First forming mechanism with a first forming portion
- Second forming mechanism with a matching second forming portion
- Heating modules for heat treatment
- First driving mechanism for displacement in a first direction
- Second driving mechanism for displacement in a second direction perpendicular to the first direction
- Controller for control and coordination
Potential Applications
The thermoforming device and method can be used in the manufacturing of flexible printed circuit boards for various electronic devices such as smartphones, tablets, wearables, and automotive electronics.
Problems Solved
1. Efficient and precise thermoforming of flexible printed circuit boards 2. Consistent heat treatment for improved performance and reliability
Benefits
1. Increased production efficiency 2. Enhanced quality and durability of flexible printed circuit boards 3. Cost-effective manufacturing process
Potential Commercial Applications
Optimizing Flexible Printed Circuit Board Manufacturing Process
Possible Prior Art
There are existing thermoforming devices and methods for rigid circuit boards, but specific solutions for flexible printed circuit boards may not be readily available.
=== What are the specific features of the first and second forming mechanisms? The specific features of the first and second forming mechanisms are not detailed in the abstract. It would be helpful to know more about their design and functionality.
=== How does the controller coordinate the operation of the thermoforming device? The abstract mentions a controller for the thermoforming device, but it does not explain how the controller functions or what role it plays in the operation of the device. Understanding the controller's role in the process would provide valuable insight into the overall functionality of the device.
Original Abstract Submitted
Disclosed are a thermoforming device and method for a flexible printed circuit board. The thermoforming device may include: a first forming mechanism provided with a first forming portion, the first forming portion being configured to carry the flexible printed circuit board to be processed; a second forming mechanism provided with a second forming portion which matches with the first forming portion, at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board; a first driving mechanism configured to drive the first forming mechanism and the second forming mechanism to be displaced relative to each other in a first direction; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to be displaced relative to each other in a second direction perpendicular to the first direction; and a controller.
