18544416. ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE simplified abstract (Samsung Display Co., Ltd.)
Contents
- 1 ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE
Organization Name
Inventor(s)
YANGHEE Kim of CHEONAN-SI (KR)
HYUN-CHOL Bang of SEONGNAM-SI (KR)
ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18544416 titled 'ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE
Simplified Explanation
The organic light emitting diode display described in the patent application includes a lower substrate, a sub-pixel structure, an upper substrate, a sealant, and a first power supply wire. The lower substrate has different areas such as a display area, a peripheral area, and a pad area. The sub-pixel structure is located in the display area on the lower substrate. The upper substrate is placed on top of the sub-pixel structure. The sealant is positioned in the peripheral area between the lower substrate and the upper substrate. The first power supply wire is situated between the lower substrate and the sealant, and it overlaps both the lower substrate and the sealant. The first power supply wire includes a first protrusion that extends in a specific direction within the first peripheral area.
- Lower substrate with display, peripheral, and pad areas
- Sub-pixel structure in the display area
- Upper substrate on top of the sub-pixel structure
- Sealant in the peripheral area between substrates
- First power supply wire between lower substrate and sealant with a protrusion
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, televisions, and wearable technology.
Problems Solved
This technology helps in improving the display quality and efficiency of organic light emitting diode displays by providing a structure that enhances the performance and durability of the display.
Benefits
The benefits of this technology include enhanced display quality, improved efficiency, and increased durability of organic light emitting diode displays.
Potential Commercial Applications
The potential commercial applications of this technology could be in the consumer electronics industry, specifically in the manufacturing of high-quality displays for electronic devices.
Possible Prior Art
One possible prior art related to this technology could be patents or research papers focusing on improving the structure and performance of organic light emitting diode displays.
Unanswered Questions
How does this technology compare to existing display technologies in terms of energy efficiency?
The patent application does not provide specific details on the energy efficiency comparison of this technology with existing display technologies. Further research or comparative studies would be needed to address this question.
What are the potential limitations or challenges in implementing this technology on a large scale for commercial production?
The patent application does not discuss potential limitations or challenges in large-scale commercial production. Additional information or studies would be required to understand the scalability and feasibility of implementing this technology on a commercial level.
Original Abstract Submitted
An organic light emitting diode display includes a lower substrate, a sub-pixel structure, an upper substrate, a sealant, and a first power supply wire. The lower substrate has a display area, a peripheral area, and a pad area. The sub-pixel structure is disposed in the display area on the lower substrate. The upper substrate is disposed on the sub-pixel structure. The sealant is disposed in the peripheral area between the lower substrate and the upper substrate. The first power supply wire is disposed between the lower substrate and the sealant, and overlaps the lower substrate and the sealant. The first power supply wire includes a first protrusion protruding in a first direction that is a direction from the pad area to the display area in the first peripheral area.
