18543124. CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Sheng-Yao Yang of Hsinchu City (TW)

Ling-Wei Li of Hsinchu City (TW)

Yu-Jui Wu of Hsinchu City (TW)

Cheng-Lin Huang of Hsinchu City (TW)

Chien-Chen Li of Hsinchu (TW)

Lieh-Chuan Chen of Hsinchu City (TW)

Che-Jung Chu of Hsinchu City (TW)

Kuo-Chio Liu of Hsinchu City (TW)

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18543124 titled 'CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

Simplified Explanation

The chip package structure described in the patent application includes a chip with a conductive ring-like structure that surrounds a central region of the chip. The conductive ring-like structure is electrically insulated from the chip and has a first solder structure over it, with both structures made of different materials.

• The chip package structure includes a chip with a conductive ring-like structure.
• The conductive ring-like structure surrounds a central region of the chip and is electrically insulated from it.
• A first solder structure is placed over the conductive ring-like structure, with both structures made of different materials.

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics where efficient chip packaging is required.

Problems Solved

This technology solves the problem of ensuring proper electrical insulation and connection in chip packaging structures, which is crucial for the performance and reliability of electronic devices.

Benefits

The benefits of this technology include improved electrical connectivity, enhanced reliability, and potentially reduced manufacturing costs due to the use of different materials for the conductive ring-like structure and the solder structure.

Potential Commercial Applications

• "Innovative Chip Package Structure for Enhanced Electrical Connectivity and Reliability"

Possible Prior Art

There may be prior art related to chip package structures with conductive ring-like structures and solder structures, but specific examples are not provided in the patent application.

How does this technology compare to existing chip package structures in terms of performance and cost?

This article does not provide a direct comparison between this technology and existing chip package structures. Further research and analysis would be needed to determine the specific advantages and disadvantages of this innovation.

What are the specific materials used for the conductive ring-like structure and the solder structure in this chip package structure?

The patent application mentions that the conductive ring-like structure and the first solder structure are made of different materials, but it does not specify the exact materials used. Additional information would be required to understand the material properties and their impact on the performance of the chip package structure.

Original Abstract Submitted

A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.