18540076. SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Organization Name
Inventor(s)
Sungyeon Ryu of Chuncheon-si (KR)
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18540076 titled 'SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Simplified Explanation
The semiconductor device described in the patent application utilizes a supporting pattern to fix upper portions of active patterns during a gap-filling process, reducing the likelihood of the active patterns being bent or falling. This helps prevent failures and improves the reliability of the semiconductor device.
- Supporting pattern used to fix upper portions of active patterns
- Gap-filling process performed between active patterns
- Prevention of active patterns from being bent or fallen
- Reduction of failure in the semiconductor device
- Improvement in reliability of the semiconductor device
Potential Applications
The technology described in the patent application could be applied in various semiconductor devices where active patterns need to be supported and fixed during manufacturing processes.
Problems Solved
This technology addresses the issue of active patterns being bent or falling during gap-filling processes, which can lead to failures in semiconductor devices.
Benefits
The use of supporting patterns in semiconductor devices can help prevent failures, improve reliability, and ultimately enhance the overall performance of the devices.
Potential Commercial Applications
The technology could be valuable in the production of a wide range of semiconductor devices, including integrated circuits, microprocessors, and memory chips.
Possible Prior Art
One possible prior art could be the use of sacrificial layers or materials to support active patterns during manufacturing processes in semiconductor devices.
What materials are commonly used for supporting patterns in semiconductor devices?
Common materials used for supporting patterns in semiconductor devices include photoresist, silicon dioxide, and silicon nitride.
How does the gap-filling process work in semiconductor device fabrication?
The gap-filling process in semiconductor device fabrication involves filling the spaces between active patterns with insulating or conductive materials to ensure proper functioning of the device.
Original Abstract Submitted
Disclosed are a semiconductor device and a method of fabricating the same. In the semiconductor device, a supporting pattern may be used to fix upper portions of active patterns, when a gap-filling process is performed to fill a region between active patterns, and thus, it may be possible to prevent or reduce the likelihood of the active patterns from being bent or fallen. Thus, it may be possible to reduce failure of the semiconductor device and/or to improve reliability of the semiconductor device.
