18538483. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kaori Uebayashi of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18538483 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a connecting member with a core containing a first material and a surface layer with a first metal. The first material is an alloy with a higher corrosion resistance than the second metal, and the third metal added to the alloy has the highest proportion among the metals added and an atomic number greater than the second metal.
- The connecting member in the semiconductor device contains a core with a first material alloy and a surface layer with a first metal.
- The first material in the core has a higher corrosion resistance than the second metal and includes a third metal with the highest proportion among the added metals and an atomic number greater than the second metal.
Potential Applications
The technology described in the patent application could be applied in:
- Semiconductor manufacturing
- Electronics industry
- Automotive sector
Problems Solved
This technology helps address the following issues:
- Corrosion in semiconductor devices
- Improved electrical connections
- Enhanced durability of semiconductor components
Benefits
The benefits of this technology include:
- Increased corrosion resistance
- Improved performance of semiconductor devices
- Extended lifespan of electronic components
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Semiconductor device manufacturing
- Consumer electronics production
- Aerospace industry
Possible Prior Art
One possible prior art could be the use of different metal alloys in semiconductor devices to enhance their performance and durability.
Unanswered Questions
How does this technology compare to existing semiconductor device connection methods in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of implementing this technology compared to traditional methods. Further research or data analysis would be needed to address this question.
What impact could this technology have on the overall efficiency of semiconductor devices in various industries?
The article does not delve into the potential efficiency improvements that could result from the implementation of this technology. Additional studies or practical applications would be necessary to assess its impact on efficiency.
Original Abstract Submitted
A semiconductor device includes a semiconductor element, a first lead electrically connected to the semiconductor element, and a connecting member connected to the semiconductor element and the first lead. The connecting member includes a core containing a first material, and a surface layer. The surface layer contains a first metal and covers the core. The first material includes an alloy in which at least a third metal is added to a second metal and has a higher corrosion resistance than the second metal. The third metal has the highest proportion among the metals added and has an atomic number greater than the second metal.
