18537297. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
Contents
- 1 INSULATION MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INSULATION MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the encapsulation resin affect the performance of the insulation module?
- 1.11 Are there any specific design considerations for the terminals and recessed-projecting portions?
- 1.12 Original Abstract Submitted
INSULATION MODULE
Organization Name
Inventor(s)
Masahiko Arimura of Kyoto-shi (JP)
Tomoichiro Toyama of Kyoto-shi (JP)
INSULATION MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18537297 titled 'INSULATION MODULE
Simplified Explanation
The insulation module described in the patent application includes a photocoupler, a plate-shaped member with light-transmitting properties, an encapsulation resin, and terminals on a plastic side surface. The plate-shaped member is positioned between the light-receiving and light-emitting elements, with the encapsulation resin encapsulating both elements. Recessed-projecting portions are located between adjacent terminals on the plastic side surface.
- Photocoupler components: The module consists of a first light-emitting element and a first light-receiving element that form a photocoupler.
- Plate-shaped member: A first plate-shaped member with light-transmitting properties is placed between the light-receiving and light-emitting elements.
- Encapsulation resin: The encapsulation resin covers and protects the light-emitting and light-receiving elements.
- Terminals: Multiple terminals are situated on a plastic side surface of the encapsulation resin, with recessed-projecting portions between adjacent terminals.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, telecommunications, and automotive for signal transmission and isolation purposes.
Problems Solved
This technology helps in providing insulation and protection to the light-emitting and light-receiving elements, ensuring their proper functioning and longevity. It also helps in maintaining signal integrity by preventing interference.
Benefits
The benefits of this technology include improved reliability, increased durability, enhanced signal transmission quality, and overall better performance of devices utilizing this insulation module.
Potential Commercial Applications
- "Insulation Module with Photocoupler Components for Signal Transmission and Isolation" could be used in electronic devices, telecommunications equipment, and automotive systems for signal processing and isolation purposes.
Possible Prior Art
There may be prior art related to insulation modules with photocoupler components used in electronic devices and telecommunications equipment for signal transmission and isolation. However, specific examples of prior art are not provided in this context.
Unanswered Questions
How does the encapsulation resin affect the performance of the insulation module?
The article does not delve into the specific properties of the encapsulation resin and how it impacts the overall functionality and efficiency of the insulation module.
Are there any specific design considerations for the terminals and recessed-projecting portions?
The article does not provide details on the design considerations or specific requirements for the terminals and recessed-projecting portions, leaving room for further exploration and analysis in this area.
Original Abstract Submitted
This insulation module includes: a first light-emitting element and a first light-receiving element that constitute a photocoupler; a first plate-shaped member that has light-transmitting properties and is provided between the first light-receiving element and the first light-emitting element; an encapsulation resin that at least encapsulates the light-emitting element and the light-receiving element; and a plurality of terminals that are provided to a first plastic side surface of the encapsulation resin. The first plate-shaped member is layered on the light-receiving surface of the first light-receiving element, and the first light-emitting element is layered on the first plate-shaped member. Recessed-projecting portions are provided to sections between adjacent terminals among the plurality of terminals on the first plastic side surface.
