18529889. MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Jae Hong Park of Suwon-si (KR)
Seon Gyun Baek of Suwon-si (KR)
MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18529889 titled 'MEMORY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation
The memory device described in the abstract includes a memory module with a memory connector, a first enclosure above the memory module, and a second enclosure below the memory module. The first enclosure has a main cover, clamping hole, inter-device fastening pillar, and coupling hole.
- Memory device with memory module, memory connector, and enclosures
- First enclosure with main cover, clamping hole, fastening pillar, and coupling hole
Potential Applications
The technology described in the patent application could be applied in:
- Computer memory systems
- Data storage devices
Problems Solved
This technology helps in:
- Securing memory modules in electronic devices
- Protecting memory connectors from damage
Benefits
The benefits of this technology include:
- Improved stability of memory modules
- Enhanced durability of memory connectors
Potential Commercial Applications
This technology could be used in:
- Computer hardware manufacturing
- Consumer electronics production
Possible Prior Art
One possible prior art for this technology could be:
- Existing memory module enclosures with fastening mechanisms
Unanswered Questions
How does this technology compare to existing memory module enclosures?
The article does not provide a direct comparison to existing memory module enclosures in terms of design, functionality, or performance.
What are the specific electronic devices that could benefit from this technology?
The article does not specify the types of electronic devices that could utilize this memory device technology.
Original Abstract Submitted
A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
