18528856. ELECTRONIC APPARATUS simplified abstract (DENSO CORPORATION)
Contents
- 1 ELECTRONIC APPARATUS
ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Kenichiro Takagi of Nisshin-city (JP)
Akira Tokumasu of Kariya-city (JP)
ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18528856 titled 'ELECTRONIC APPARATUS
Simplified Explanation
The patent application describes an electronic apparatus with two conductive parts, each consisting of a surface layer part and an inner layer part in the substrate. The first conductive part has a first inner layer part protruding towards the second conductive part, while the second conductive part has a second inner layer part protruding towards the first conductive part.
- The electronic apparatus includes two conductive parts with surface and inner layer parts in the substrate.
- The first conductive part has a protrusion towards the second conductive part, and the second conductive part has a protrusion towards the first conductive part.
Potential Applications
This technology could be applied in electronic devices, circuit boards, and sensors.
Problems Solved
This technology helps improve signal transmission and connectivity in electronic devices.
Benefits
Enhanced performance, improved reliability, and increased efficiency in electronic systems.
Potential Commercial Applications
This technology could be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment.
Possible Prior Art
Prior art may include similar patents related to conductive parts with protrusions for improved connectivity.
Unanswered Questions
How does this technology impact the cost of electronic devices?
The cost implications of implementing this technology in electronic devices are not addressed in the patent application.
What materials are used in the construction of the conductive parts?
The specific materials used in the construction of the conductive parts are not detailed in the patent application.
Original Abstract Submitted
The first conductive part includes a first surface layer part and a first inner layer part constituting a layer different from the first surface layer part in the substrate. The second conductive part includes a second surface layer part facing the first surface layer part with a creeping distance therebetween, and a second inner layer part constituting a layer different from the second surface layer part in the substrate. The electronic apparatus is provided with at least one of a first protruded configuration and a second protruded configuration. The first protruded configuration is configured such that the first inner layer part includes a first conductive protrusion protruding towards the second conductive part from the first surface layer part. The second protruded configuration is configured such that the second inner layer part includes a second conductive protrusion protruding towards the first conductive part from the second surface layer part.
