18527618. HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS simplified abstract (Texas Instruments Incorporated)
Contents
- 1 HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall size and layout of the integrated circuit?
- 1.11 What specific materials are used in the construction of the metal plate, metal ring, and protective overcoat layers?
- 1.12 Original Abstract Submitted
HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS
Organization Name
Texas Instruments Incorporated
Inventor(s)
Jeffrey Alan West of Dallas TX (US)
Thomas Dyer Bonifield of Dallas TX (US)
HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18527618 titled 'HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS
Simplified Explanation
The patent application describes an integrated circuit with a metal plate or coil, a metal ring, and protective overcoat layers over a semiconductor substrate.
- The integrated circuit includes a semiconductor substrate.
- There are multiple dielectric layers on top of the semiconductor substrate, including a top dielectric layer.
- A metal plate or metal coil is positioned over the top dielectric layer.
- A metal ring is located over the top dielectric layer and surrounds the metal plate or coil.
- A protective overcoat covers the metal ring and the metal plate or coil.
- A trench opening is formed through the protective overcoat, exposing the top dielectric layer between the metal plate/coil and the metal ring.
Potential Applications
This technology could be applied in the fields of semiconductor manufacturing, integrated circuits, and electronic devices requiring precise and reliable electrical connections.
Problems Solved
This innovation helps in providing a secure and protected electrical connection within the integrated circuit, reducing the risk of damage or interference.
Benefits
The integrated circuit design offers improved durability, stability, and performance, ensuring the longevity and efficiency of electronic devices.
Potential Commercial Applications
- "Enhancing Electrical Connections in Integrated Circuits for Improved Performance and Reliability"
Possible Prior Art
There may be prior art related to similar integrated circuit designs with metal plates or coils, metal rings, and protective overcoats, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology impact the overall size and layout of the integrated circuit?
The patent application does not mention how the presence of the metal plate, metal ring, and protective overcoat layers affect the size and layout of the integrated circuit.
What specific materials are used in the construction of the metal plate, metal ring, and protective overcoat layers?
The patent application does not provide detailed information on the materials used for these components, which could impact the performance and reliability of the integrated circuit.
Original Abstract Submitted
An integrated circuit includes a semiconductor substrate and a plurality of dielectric layers over the semiconductor substrate, including a top dielectric layer. A metal plate or metal coil is located over the top dielectric layer; a metal ring is located over the top dielectric layer and substantially surrounds the metal plate or metal coil. A protective overcoat overlies the metal ring and overlies the metal plate or metal coil. A trench opening is formed through the protective overcoat, with the trench opening exposing the top dielectric layer between the metal plate/coil and the metal ring, the trench opening substantially surrounding the metal plate or metal coil.
