18527457. SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

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SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Barry Jon Male of West Granby CT (US)

Paul Merle Emerson of Madison AL (US)

Sandeep Shylaja Krishnan of BANGALORE (IN)

SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC - A simplified explanation of the abstract

This abstract first appeared for US patent application 18527457 titled 'SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC

Simplified Explanation

The abstract of the patent application describes a packaged integrated circuit (IC) with a leadframe, a die pad, a first circuit, a second circuit, an attachment layer, and a mold compound encapsulating the circuits and attachment layer.

  • The packaged IC includes a leadframe with a die pad.
  • The first circuit on the die pad has a region.
  • The second circuit is on the first circuit, spaced from the region by a gap.
  • An attachment layer is between the first and second circuits, enclosing at least part of the gap over the region.
  • A mold compound encapsulates the first and second circuits, the attachment layer, and at least part of the gap.

Potential Applications

The technology described in this patent application could be applied in various electronic devices and systems that require compact and reliable integrated circuits, such as smartphones, tablets, computers, automotive electronics, and more.

Problems Solved

This technology solves the problem of ensuring proper electrical connections and insulation between different circuits within a packaged integrated circuit, while also providing protection from external environmental factors.

Benefits

The benefits of this technology include improved reliability, compactness, and durability of integrated circuits, leading to enhanced performance and longevity of electronic devices.

Potential Commercial Applications

The technology described in this patent application has potential commercial applications in the semiconductor industry, electronics manufacturing, consumer electronics, automotive electronics, telecommunications, and other industries requiring advanced integrated circuit packaging solutions.

Possible Prior Art

One possible prior art for this technology could be the use of various materials and methods for encapsulating and protecting integrated circuits within a package, such as different types of mold compounds, attachment layers, and leadframe designs.

Unanswered Questions

How does this technology compare to existing methods of encapsulating integrated circuits?

This article does not provide a direct comparison between this technology and existing methods of encapsulating integrated circuits.

What specific materials are used in the attachment layer and mold compound?

The article does not specify the exact materials used in the attachment layer and mold compound.


Original Abstract Submitted

A packaged integrated circuit (IC) includes a leadframe including a die pad. The packaged IC also includes a first circuit on the die pad, the first circuit having a region. The packaged IC also includes a second circuit on the first circuit, the second circuit being spaced from the region by a gap. The packaged IC also includes an attachment layer between the first and second circuits, the attachment layer and the first and second circuits enclosing at least a part of the gap over the region. The packaged IC also includes a mold compound encapsulating the first and second circuits, the attachment layer, and the at least part of the gap.

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