18526350. SUBSTRATE PROCESSING APPARATUS simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Kouichi Mizunaga of Koshi City (JP)
Toshichika Takei of Koshi City (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18526350 titled 'SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The heat treatment unit described in the patent application includes a heat plate for heating a wafer, multiple gap members to support the wafer and maintain a clearance, a suction unit to hold the wafer in place, and an elevating pin to move the wafer up and down. The front surface of the heat plate is concave, sloping downwards from the outer side to the inner side.
- Heat treatment unit components:
* Heat plate for heating wafer * Multiple gap members for wafer support * Suction unit for wafer fixation * Elevating pin for wafer movement
- Front surface of heat plate design:
* Concave region sloping downwards * Inner side lower than outer side
Potential Applications
The heat treatment unit can be used in semiconductor manufacturing processes, specifically in the heat treatment of wafers for integrated circuits.
Problems Solved
1. Ensures uniform heating of wafers 2. Provides precise control over wafer movement during treatment
Benefits
1. Improved efficiency in wafer heat treatment 2. Enhanced quality and consistency of semiconductor products
Potential Commercial Applications
Optimizing Semiconductor Wafer Heat Treatment for Enhanced Product Quality
Possible Prior Art
There may be prior art related to heat treatment units for semiconductor manufacturing processes, but specific examples are not provided in the patent application.
Unanswered Questions
How does the concave design of the heat plate improve wafer heating efficiency?
The concave design of the heat plate may help in directing heat towards the center of the wafer, ensuring more uniform heating. This can result in better quality control during the manufacturing process.
What materials are used in the construction of the heat plate and other components of the unit?
The patent application does not specify the materials used in the construction of the heat plate, gap members, suction unit, or elevating pin. Understanding the materials used can provide insights into the durability and performance of the heat treatment unit.
Original Abstract Submitted
A heat treatment unit U includes a heat plate configured to place a wafer W thereon and heat the wafer W placed thereon; multiple gap members formed along a front surface of the heat plate on which the wafer W is placed, and configured to support the wafer W to secure a clearance V between the heat plate and the wafer W; a suction unit configured to suck the wafer W toward the heat plate ; and an elevating pin configured to penetrate the heat plate and configured to be moved up and down to move the wafer W placed on the heat plate up and down. The front surface of the heat plate has a concave region inclined downwards from an outer side toward an inner side thereof.
