18524839. Light-Emitting Device And Electronic Device simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
Contents
Light-Emitting Device And Electronic Device
Organization Name
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor(s)
Shunpei Yamazaki of Tokyo (JP)
Light-Emitting Device And Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18524839 titled 'Light-Emitting Device And Electronic Device
Simplified Explanation
The patent application describes a highly reliable light-emitting device that suppresses damage to elements due to external physical power or heat during pressure-bonding processes. It also positions a neutral plane to prevent stress-strain when the device is deformed and ensures a high hardness of the outermost surface. Additionally, it uses a substrate with a low coefficient of thermal expansion to overlap with a terminal portion connected to an FPC.
- Damage to elements due to external physical power or heat is suppressed
- Neutral plane positioned to prevent stress-strain during deformation
- High hardness of the outermost surface
- Low coefficient of thermal expansion substrate used for connection to FPC
- Potential Applications
The technology could be applied in the manufacturing of electronic devices, such as smartphones, tablets, and TVs, where reliable light-emitting devices are essential.
- Problems Solved
The technology addresses issues related to damage to elements during external physical power or heat exposure, deformation stress-strain, and the need for high hardness in light-emitting devices.
- Benefits
The benefits of this technology include increased reliability, durability, and performance of light-emitting devices, leading to improved overall product quality.
- Potential Commercial Applications
The technology could find commercial applications in the consumer electronics industry, particularly in the production of high-quality displays for various devices.
- Possible Prior Art
Prior art may include patents or research related to the manufacturing processes of light-emitting devices, flexible substrates, and materials with low coefficients of thermal expansion.
- Unanswered Questions
- How does the technology compare to existing solutions in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of implementing this technology compared to existing solutions.
- What are the environmental implications of using the described materials and processes?
The article does not address the environmental impact of using the materials and processes described in the patent application.
Original Abstract Submitted
A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
