18523173. CAMERA MODULE simplified abstract (Samsung Electro-Mechanics Co., Ltd.)

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CAMERA MODULE

Organization Name

Samsung Electro-Mechanics Co., Ltd.

Inventor(s)

Jae Hyuk Lee of Suwon-si (KR)

Soo Cheol Lim of Suwon-si (KR)

Byung Woo Kang of Suwon-si (KR)

Young Bok Yoon of Suwon-si (KR)

Jong Woo Hong of Suwon-si (KR)

Jung Seok Lee of Suwon-si (KR)

CAMERA MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18523173 titled 'CAMERA MODULE

Simplified Explanation

The camera module described in the patent application includes a movable body within a housing, a reinforcing member on the movable body to increase rigidity, and a buffer member to reduce impact forces between the housing and the movable body.

  • The movable body is configured to move in the direction of the optical axis of the housing.
  • The reinforcing member is formed integrally on one surface of the movable body to increase its rigidity.
  • The first buffer member is formed within the reinforcing member to reduce impactive forces between the housing and the movable body.

Potential Applications

The technology described in this patent application could be applied to various camera modules in smartphones, digital cameras, security cameras, and other imaging devices.

Problems Solved

This technology helps to improve the stability and durability of camera modules by reducing impact forces and increasing the rigidity of the movable body.

Benefits

The benefits of this technology include enhanced image quality, longer lifespan of the camera module, and improved overall performance of imaging devices.

Potential Commercial Applications

Potential commercial applications of this technology include smartphone manufacturers, camera companies, security system providers, and other industries that utilize camera modules in their products.

Possible Prior Art

One possible prior art for this technology could be similar patents or innovations related to improving the stability and durability of camera modules by reducing impact forces and increasing rigidity.

Unanswered Questions

How does this technology compare to existing solutions in the market?

This article does not provide a direct comparison to existing solutions in the market, leaving the reader to wonder about the competitive advantages of this technology.

What are the specific materials used in the reinforcing member and buffer member?

The article does not specify the materials used in the reinforcing member and buffer member, which could be important for understanding the performance and durability of the camera module.


Original Abstract Submitted

A camera module includes a housing, a movable body configured to move in a direction of an optical axis of the housing; a reinforcing member formed integrally on one surface of the movable body, and configured to increase a rigidity of the movable body; and a first buffer member formed in the reinforcing member, and configured to reduce an impactive force between the housing and the movable body.