18523085. BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME simplified abstract (Samsung Display Co., Ltd.)
Contents
- 1 BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME
Organization Name
Inventor(s)
TAEHYEOG Jung of Hwaseong-si (KR)
BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523085 titled 'BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME
Simplified Explanation
The bonding device described in the patent application consists of a stage and a pressing part, with layers that include flat portions and bending portions to facilitate bonding processes.
- The bonding device includes a stage and a pressing part.
- The first layer on the stage has flat and bending portions.
- The second layer below the pressing part also has flat and bending portions.
- The bending portions are bent with curvatures between the stage and pressing part.
- The curvature of the second bending portions is smaller than that of the first bending portions.
Potential Applications
The technology described in this patent application could be applied in industries such as electronics, automotive, aerospace, and medical devices for bonding various materials together.
Problems Solved
This technology solves the problem of achieving strong and reliable bonds between different materials by providing a unique structure that allows for controlled bending during the bonding process.
Benefits
The benefits of this technology include improved bonding strength, increased reliability, and the ability to bond materials that may have been challenging to bond using traditional methods.
Potential Commercial Applications
With its ability to enhance bonding processes, this technology could find applications in manufacturing processes for a wide range of products, leading to increased efficiency and quality in production.
Possible Prior Art
One possible prior art for this technology could be similar bonding devices with bending portions, but the specific curvature differences described in this patent application may be a novel feature.
Unanswered Questions
How does the curvature of the bending portions affect the bonding process?
The curvature of the bending portions plays a crucial role in controlling the pressure and contact area during the bonding process, but the exact impact of these curvature differences on the bond strength needs further investigation.
Are there any limitations to the materials that can be bonded using this technology?
While the patent application mentions bonding different materials, it is essential to determine if there are any restrictions on the types of materials that can be effectively bonded using this bonding device.
Original Abstract Submitted
A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. The curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.
