18522980. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE AND METHOD

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chung-Hui Chen of Hsinchu (TW)

SEMICONDUCTOR DEVICE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18522980 titled 'SEMICONDUCTOR DEVICE AND METHOD

Simplified Explanation

The semiconductor device described in the abstract includes a first conductive line, a first power rail, and a first transistor with specific components and connections.

• The device features a first conductive line on the front side of a semiconductor wafer and a first power rail on the back side.
• A first transistor is included, with a first gate structure, first and second active regions, and a first channel region.
• A first via connects the first active region to the first conductive line, while a second via connects the second active region to the first power rail.

Potential Applications

This technology could be applied in various electronic devices, such as smartphones, computers, and other consumer electronics, to enhance their performance and efficiency.

Problems Solved

This innovation helps improve the connectivity and functionality of semiconductor devices, ensuring reliable operation and optimal performance in electronic systems.

Benefits

The use of this technology can lead to increased speed, reduced power consumption, and improved overall performance of electronic devices, providing a better user experience.

Potential Commercial Applications

The technology described in the patent application could be utilized in the semiconductor industry for the development of advanced integrated circuits and microprocessors, offering competitive advantages to companies in the market.

Possible Prior Art

One possible prior art in this field could be the development of similar semiconductor devices with different configurations and connection methods, which may have influenced the design of the current innovation.

How does this technology compare to existing solutions in terms of efficiency and cost-effectiveness?

This article does not provide a direct comparison with existing solutions in terms of efficiency and cost-effectiveness. Further research and analysis would be needed to evaluate the technology's competitiveness in the market.

What are the potential challenges or limitations of implementing this technology on a larger scale?

The article does not address the potential challenges or limitations of implementing this technology on a larger scale. Factors such as manufacturing processes, scalability, and compatibility with existing systems could pose obstacles that need to be considered.

Original Abstract Submitted

A semiconductor device includes a first conductive line extending in a first direction on a front side of a semiconductor wafer, a first power rail extending in the first direction on a back side of the semiconductor wafer, and a first transistor including a first gate structure extending in a second direction perpendicular to the first direction, first and second active regions adjacent to the first gate structure, and a first channel region extending between the first and second active regions through the first gate structure. A first via is positioned between and electrically connects the first active region and the first conductive line, and a second via is positioned between and electrically connects the second active region and the first power rail.