18522110. SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Satoshi Goto of Nagaokakyo-shi (JP)
Masao Kondo of Nagaokakyo-shi (JP)
Shigeki Koya of Nagaokakyo-shi (JP)
Takayuki Tsutsui of Nagaokakyo-shi (JP)
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522110 titled 'SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor module described in the patent application consists of two members: the first member includes a semiconductor substrate made of a compound semiconductor and a first electronic circuit mounted on a module substrate, while the second member includes a semiconductor layer made of a single semiconductor thinner than the substrate of the first member and a second electronic circuit bonded to the upper surface of the first member. The two members are connected by inter-member connection wires and pads, with wires connecting the pads to substrate side pads.
- Explanation of the patent:
- Semiconductor module with two members, each with different semiconductor materials and electronic circuits. - Inter-member connection wires and pads for connecting the electronic circuits. - Wires connecting the pads to substrate side pads for additional connections.
Potential Applications
This technology could be applied in: - High-speed communication devices - Power electronics - Sensor systems
Problems Solved
- Integration of different semiconductor materials in a single module - Efficient connection between electronic circuits - Reduction of size and weight of semiconductor modules
Benefits
- Improved performance and efficiency - Enhanced reliability and durability - Cost-effective manufacturing process
Potential Commercial Applications
"Semiconductor Module with Inter-Member Connection Wires and Pads" in: - Telecommunications industry - Automotive electronics - Aerospace technology
Possible Prior Art
Prior art related to semiconductor module integration and interconnection techniques may exist, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology compare to existing semiconductor module designs in terms of performance and reliability?
This article does not provide a direct comparison with existing semiconductor module designs, so it is unclear how this technology stacks up against current solutions.
What are the specific manufacturing processes involved in creating the semiconductor module described in the patent application?
The patent application does not detail the specific manufacturing processes used to create the semiconductor module, leaving questions about the production methods unanswered.
Original Abstract Submitted
A semiconductor module comprises a first member including a semiconductor substrate made of a compound semiconductor and a first electronic circuit on the semiconductor substrate is mounted on a mounting surface of a module substrate, and a second member including a semiconductor layer formed of a single semiconductor thinner than the semiconductor substrate of the first member and a second electronic circuit on the semiconductor layer is bonded to an upper surface of the first member. First and second pads are respectively connected to the first electronic circuit on the first member and the second electronic circuit on the second member. A first wire connects the first pad and a substrate side pad. A second wire connects the second pad and a substrate side pad. An inter-member connection wire made of a conductor film on the first and second members connects the first and second electronic circuits.
