18521375. INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Ying Chen of Hsinchu (TW)
INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521375 titled 'INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD
Simplified Explanation
The method described in the abstract involves generating an integrated circuit layout diagram by overlapping various regions within the circuit.
- Overlapping an active region with gate regions to define a program transistor and a read transistor of a one-time-programmable (OTP) bit.
- Overlapping a through via region with a gate region or active region, and then overlapping the through via region with a metal region of a back-side metal layer.
Potential Applications
This technology could be applied in the semiconductor industry for the development of advanced integrated circuits with improved performance and functionality.
Problems Solved
This method solves the problem of efficiently designing and fabricating integrated circuits with complex layouts and multiple functionalities.
Benefits
The benefits of this technology include enhanced circuit performance, increased functionality, and improved reliability of integrated circuits.
Potential Commercial Applications
The potential commercial applications of this technology include the production of high-performance electronic devices, such as smartphones, tablets, and computers.
Possible Prior Art
One possible prior art for this technology could be the use of similar methods in the design and fabrication of integrated circuits in the semiconductor industry.
Unanswered Questions
How does this method compare to existing techniques for generating IC layout diagrams?
This article does not provide a direct comparison to existing techniques, leaving the reader to wonder about the specific advantages of this method over others.
What are the specific limitations or challenges of implementing this technology in practical applications?
The article does not address any potential limitations or challenges that may arise when implementing this technology, leaving room for further exploration and analysis.
Original Abstract Submitted
A method of generating an integrated circuit (IC) layout diagram includes overlapping an active region with a plurality of gate regions, thereby defining a program transistor and a read transistor of a one-time-programmable (OTP) bit, overlapping a through via region with a gate region of the plurality of gate regions or with the active region, and overlapping the through via region with a metal region of a back-side metal layer.
