18520425. COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY simplified abstract (Intel Corporation)

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY

Organization Name

Intel Corporation

Inventor(s)

Phil Geng of Washougal WA (US)

David Shia of Portland OR (US)

Ralph V. Miele of Hillsboro OR (US)

Guixiang Tan of Portland OR (US)

Jimmy Chuang of Taipei (TW)

Sandeep Ahuja of Portland OR (US)

Sanjoy K. Saha of Portland OR (US)

Jeffory L. Smalley of Olympia WA (US)

Mark E. Sprenger of Tigard OR (US)

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18520425 titled 'COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY

Simplified Explanation

The apparatus described in the patent application is a cooling system for a semiconductor chip package, consisting of a main cooling mass, a heat pipe, and a remote cooling mass. The system includes a channel in one of the cooling masses for the heat pipe to move within, a flexible region integrated into the heat pipe, and a flexible connector for the heat pipe.

• The apparatus includes a channel in one of the cooling masses for the heat pipe to move within, allowing for relative movement of the main and remote cooling masses.
• The main cooling mass has a chamber with liquid, and the heat pipe has a fluidic channel coupled to the chamber for condensing vapor from the liquid.
• A flexible region is integrated into the heat pipe for added flexibility.
• A flexible connector is used for inserting the heat pipe into the system.

Potential Applications

The technology can be applied in various electronic devices requiring efficient cooling systems, such as computers, servers, and mobile devices.

Problems Solved

The cooling system addresses the issue of overheating in semiconductor chip packages, ensuring optimal performance and longevity of electronic devices.

Benefits

The apparatus provides effective cooling for semiconductor chip packages, extending the lifespan of electronic devices and improving overall performance.

Potential Commercial Applications

The cooling system can be utilized by electronics manufacturers to enhance the cooling efficiency of their products, attracting customers looking for reliable and high-performance devices.

Possible Prior Art

Prior art may include traditional cooling systems for electronic devices, such as fans and heat sinks, which may not offer the same level of efficiency and flexibility as the described apparatus.

How does the flexible region integrated into the heat pipe enhance the overall performance of the cooling system?

The flexible region allows for better adaptation to movement between the main and remote cooling masses, ensuring continuous and efficient heat transfer.

What materials are used in the construction of the heat pipe and cooling masses to optimize heat dissipation and durability?

The materials used in the construction of the heat pipe and cooling masses play a crucial role in the effectiveness and longevity of the cooling system, but this information is not provided in the abstract.

Original Abstract Submitted

An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.