18519513. SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Fei Fan Duan of Hsinchu (TW)

Fong-yuan Chang of Hsinchu (TW)

Chi-Yu Lu of Hsinchu (TW)

Po-Hsiang Huang of Hsinchu (TW)

Chih-Liang Chen of Hsinchu (TW)

SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18519513 titled 'SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

Simplified Explanation

The semiconductor device described in the abstract includes active regions, conductive patterns, and metal lines, all interconnected in parallel on a substrate.

  • Active regions: First and second active regions extend in parallel in the substrate.
  • Conductive patterns: Plurality of conductive patterns extend on the substrate across the active regions.
  • Metal lines: Plurality of metal lines overlie and extend across the active regions, each electrically connected in parallel with the conductive patterns.

Potential Applications

This technology could be applied in:

  • Integrated circuits
  • Microprocessors
  • Memory devices

Problems Solved

This technology helps in:

  • Improving electrical connectivity
  • Enhancing performance of semiconductor devices

Benefits

The benefits of this technology include:

  • Increased efficiency
  • Enhanced reliability
  • Better overall performance

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Electronics industry
  • Semiconductor manufacturing sector
  • Consumer electronics market

Possible Prior Art

There may be prior art related to:

  • Semiconductor device interconnect technologies
  • Parallel electrical connections in semiconductor devices

Unanswered Questions

How does this technology impact power consumption in semiconductor devices?

This article does not address the specific impact of this technology on power consumption in semiconductor devices. It would be interesting to explore how the parallel electrical connections affect power efficiency.

What are the potential limitations or challenges in implementing this technology on a large scale?

The article does not discuss any potential limitations or challenges in implementing this technology on a large scale. It would be important to consider factors such as manufacturing costs, scalability, and compatibility with existing technologies.


Original Abstract Submitted

A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.