18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chin-Hua Wang of New Taipei City (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Yu-Sheng Lin of Hsinchu County (TW)
Po-Yao Lin of Hsinchu County (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18518466 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in this patent application includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener, and a top stiffener. The wiring substrate has two surfaces, with the semiconductor component placed on one surface and the conductor terminals on the other surface, connected to the semiconductor component. The bottom stiffener is positioned between the conductor terminals on the second surface, while the top stiffener is spaced further away from the semiconductor component on the first surface.
- Wiring substrate with semiconductor component and conductor terminals
- Bottom stiffener positioned between conductor terminals
- Top stiffener spaced further away from semiconductor component
Potential Applications
- Semiconductor packaging
- Electronics manufacturing
Problems Solved
- Protection of semiconductor component
- Enhanced structural integrity
Benefits
- Improved durability
- Enhanced performance
- Increased reliability
Original Abstract Submitted
A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.
