18518448. SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Jie Chen of New Taipei City (TW)
Hsien-Wei Chen of Hsinchu City (TW)
Ming-Fa Chen of Taichung City (TW)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18518448 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the patent application includes a die with a device and multiple conductive patterns arranged over the device. These conductive patterns are interconnected to create a first coil and a second coil that encircle the first coil.
- The semiconductor package comprises a die with a device and conductive patterns.
- The conductive patterns are connected to form two coils surrounding each other.
- The coils are designed to enhance the performance of the semiconductor package.
Potential Applications
The technology described in the patent application could be used in:
- Wireless communication devices
- RFID technology
- Power management systems
Problems Solved
This technology addresses issues such as:
- Electromagnetic interference
- Signal loss
- Space constraints in semiconductor packaging
Benefits
The benefits of this technology include:
- Improved signal transmission
- Enhanced device performance
- Space-efficient design
Original Abstract Submitted
A semiconductor package includes a die and a plurality of conductive patterns. The die includes a device. The conductive patterns are disposed over the device, wherein the conductive patterns are electrically connected to one another to form a first coil and a second coil surrounding the first coil.
