18517599. PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Dongjae Shin of Seoul (KR)

Dongsik Shim of Hwaseong-si (KR)

Eunkyung Lee of Seoul (KR)

Changbum Lee of Seoul (KR)

Bongyong Jang of Suwon-si (KR)

PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18517599 titled 'PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME

Simplified Explanation

The photonic integrated circuit platform described in the patent application includes multiple layers of different materials to enable the formation of optical elements for various applications. Here are some key points to explain the innovation:

  • The platform consists of a substrate, oxide layers, and optical element layers made of semiconductor and compound semiconductor materials.
  • The optical elements are formed by patterning the semiconductor and compound semiconductor layers to create specific functionalities.
  • The use of different insulating materials in the oxide layers allows for improved performance and integration of the optical elements.
  • The platform enables the creation of complex photonic integrated circuits with enhanced optical properties and functionality.

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      1. Potential Applications of this Technology

The technology described in the patent application could be applied in various fields such as telecommunications, data centers, sensing, and quantum computing.

      1. Problems Solved by this Technology

This technology addresses the challenges of integrating multiple optical elements on a single platform, enabling the development of more compact and efficient photonic integrated circuits.

      1. Benefits of this Technology

The benefits of this technology include improved performance, increased functionality, and enhanced integration capabilities for photonic integrated circuits.

      1. Potential Commercial Applications of this Technology

The technology could find commercial applications in the development of advanced optical communication systems, high-speed data processing, optical sensors, and quantum information processing.

      1. Possible Prior Art

One possible prior art for this technology could be the development of photonic integrated circuits using traditional semiconductor materials and fabrication techniques.

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      1. Unanswered Questions
        1. How does the performance of the photonic integrated circuit platform compare to existing technologies?

The article does not provide specific details on the performance metrics or comparisons with other technologies in the field.

        1. What are the potential scalability limitations of this technology?

The scalability of the platform for mass production and commercial applications is not discussed in the article.


Original Abstract Submitted

A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.