18517194. SEMICONDUCTOR WAFER CLEANING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR WAFER CLEANING APPARATUS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chia-Lun Chen of Taichung City (TW)
Po-Jen Shih of Tainan City (TW)
Ming-Sung Hung of Taichung City (TW)
Wen-Hung Hsu of Taichung City (TW)
SEMICONDUCTOR WAFER CLEANING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517194 titled 'SEMICONDUCTOR WAFER CLEANING APPARATUS
Simplified Explanation
The semiconductor wafer cleaning apparatus described in the patent application includes a spin base, a spindle with a mounting part and a supporting part, a clamping member, and a first sealing ring. The mounting part of the spindle has an inner projection, while the supporting part has a conical projection surrounded by the inner projection.
- Spin base, spindle, clamping member, and sealing ring are key components of the semiconductor wafer cleaning apparatus.
- Spindle consists of mounting part and supporting part with specific features like inner projection and conical projection.
- Clamping member covers the spin base to secure the wafer during the cleaning process.
- First sealing ring is placed between the spin base and the mounting part to prevent leakage.
Potential Applications
The semiconductor wafer cleaning apparatus can be used in semiconductor manufacturing facilities for cleaning wafers before processing, ensuring high-quality production.
Problems Solved
1. Efficient cleaning of semiconductor wafers. 2. Secure clamping of wafers during the cleaning process. 3. Prevention of leakage during cleaning operations.
Benefits
1. Improved wafer cleaning process. 2. Enhanced quality of semiconductor products. 3. Increased productivity in manufacturing facilities.
Original Abstract Submitted
A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.
