18513866. SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ya-Huei Lee of Zhunan Township (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Shyue-Ter Leu of Hsinchu City (TW)
Po-Yao Lin of Zhudong Township (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513866 titled 'SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
Simplified Explanation
The semiconductor die package described in the patent application includes a semiconductor die and a package substrate that supports and is electrically connected to the die. The package substrate contains conductive lines, with one of the lines positioned under a corner of the semiconductor die. This particular line consists of a linear first segment and a non-linear second segment that varies in direction.
- Semiconductor die package with semiconductor die and package substrate
- Package substrate includes conductive lines, one positioned under die corner
- Line under corner has linear first segment and non-linear second segment
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
The innovation addressed in this patent application helps solve the following issues:
- Ensuring proper electrical connection in semiconductor packages
- Enhancing the reliability of semiconductor devices
Benefits
The technology offers the following benefits:
- Improved electrical connectivity
- Enhanced performance and reliability of semiconductor devices
Potential Commercial Applications
A potential commercial application for this technology could be:
- Semiconductor packaging solutions for consumer electronics
Possible Prior Art
One possible prior art related to this technology could be:
- Existing semiconductor packaging techniques and designs
Unanswered Questions
Question 1:
How does the non-linear second line segment improve the performance of the semiconductor die package?
Answer:
The non-linear second line segment allows for flexibility in routing the conductive line, potentially reducing signal interference and improving overall electrical performance.
Question 2:
What specific materials are used in the construction of the package substrate to support the semiconductor die?
Answer:
The patent application does not provide detailed information on the specific materials used in the package substrate construction. Additional research or examination of the full patent document may be required to obtain this information.
Original Abstract Submitted
A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.
