18513410. MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE
Organization Name
Inventor(s)
Nobuyuki Endo of Fujisawa-shi (JP)
Tetsuya Itano of Sagamihara-shi (JP)
Kazuo Yamazaki of Yokohama-shi (JP)
Kyouhei Watanabe of Yokohama-shi (JP)
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513410 titled 'MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE
Simplified Explanation
The patent application describes a method for manufacturing a solid-state image pickup device with a bonding plane without gaps.
- The method involves bonding a first substrate with a photoelectric converter and a first wiring structure to a second substrate with a part of a peripheral circuit and a second wiring structure.
- At least one of the wiring structures has a concave portion on its upper face, with a conductive material forming the bottom face of the concave portion.
Potential Applications
This technology can be applied in the manufacturing of high-quality image sensors for digital cameras, smartphones, and other electronic devices requiring image capture capabilities.
Problems Solved
This technology solves the problem of gaps in the bonding plane of solid-state image pickup devices, which can lead to reduced image quality and reliability.
Benefits
The benefits of this technology include improved image quality, increased device reliability, and potentially lower manufacturing costs due to the simplified bonding process.
Original Abstract Submitted
A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.
