18511731. IMAGE SENSOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
IMAGE SENSOR DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chia-Yu Wei of Tainan City (TW)
Yen-Liang Lin of Tainan City (TW)
Kuo-Cheng Lee of Tainan City (TW)
Hsun-Ying Huang of Tainan City (TW)
Hsin-Chi Chen of Tainan City (TW)
IMAGE SENSOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18511731 titled 'IMAGE SENSOR DEVICE
Simplified Explanation
The patent application describes an image sensor device with a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer.
- The radiation sensing member is embedded in the semiconductor substrate.
- The interface between the radiation sensing member and the semiconductor substrate contains a direct band gap material.
- The shallow trench isolation surrounds the radiation sensing member within the semiconductor substrate.
- The color filter layer is positioned on top of the radiation sensing member.
Potential Applications
- Medical imaging devices
- Surveillance cameras
- Smartphone cameras
Problems Solved
- Improved image quality
- Enhanced color accuracy
- Reduced noise in images
Benefits
- Higher sensitivity to radiation
- Better color reproduction
- Increased durability and longevity of the image sensor device
Original Abstract Submitted
An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.
