View source for 18510864. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)

=SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME=


==Organization Name==

[[:Category:CHANGXIN MEMORY TECHNOLOGIES, INC.|CHANGXIN MEMORY TECHNOLOGIES, INC.]]


[[Category:CHANGXIN MEMORY TECHNOLOGIES, INC.]]

==Inventor(s)==

[[:Category:Yuan Fang of Hefei (CN)|Yuan Fang of Hefei (CN)]][[Category:Yuan Fang of Hefei (CN)]]

[[:Category:Yanwu Wang of Hefei (CN)|Yanwu Wang of Hefei (CN)]][[Category:Yanwu Wang of Hefei (CN)]]

==SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18510864 titled 'SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

==Simplified Explanation==

The semiconductor structure described in the patent application includes a substrate with a chip stack on top, connected through multiple first conductive structures. Each of these structures contains a first conductive bump with at least one concave surface, and the concave surfaces of adjacent bumps face each other.

* The semiconductor structure includes a substrate and a chip stack connected through first conductive structures.
* Each first conductive structure has a first conductive bump with at least one concave surface.
* The concave surfaces of adjacent first conductive bumps face each other.

== Potential Applications ==
The technology described in the patent application could be used in:
* Semiconductor manufacturing
* Electronic devices
* Integrated circuits

== Problems Solved ==
The semiconductor structure addresses issues related to:
* Efficient chip stacking
* Improved electrical connections
* Enhanced performance of electronic devices

== Benefits ==
The benefits of this technology include:
* Higher reliability in electronic devices
* Improved signal transmission
* Enhanced overall performance

== Potential Commercial Applications ==
The semiconductor structure could have commercial applications in:
* Consumer electronics
* Telecommunications
* Automotive industry

== Possible Prior Art ==
One possible prior art could be the use of traditional conductive structures in semiconductor manufacturing processes. However, the specific design of the first conductive structures with concave surfaces facing each other may be a novel aspect of this technology.

== Unanswered Questions ==
=== How does the concave surface design impact the overall performance of the semiconductor structure? ===
The patent application does not provide detailed information on the specific effects of the concave surface design on the performance of the semiconductor structure.

=== Are there any limitations to the use of this technology in certain electronic devices or applications? ===
The patent application does not discuss any potential limitations or restrictions on the use of this technology in specific electronic devices or applications.


==Original Abstract Submitted==

A semiconductor structure and a method for manufacturing the same are disclosed. The semiconductor structure includes a substrate, a chip stack disposed on the substrate through a plurality of first conductive structures. Each of the plurality of the first conductive structures includes a first conductive bump, and the first conductive bump includes at least one concave surface. Concave surfaces of adjacent first conductive bumps are disposed facing each other.



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