18510599. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chen-Hua Yu of Hsinchu City (TW)
Chun-Hui Yu of Hsinchu County (TW)
Jeng-Nan Hung of Taichung City (TW)
Kuo-Chung Yee of Taoyuan City (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18510599 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid. The semiconductor package is placed on the substrate, with the thermal conductive bonding layer on top of it. The lid is then attached to the thermal conductive bonding layer, covering the semiconductor package to prevent coolant from coming into contact with it.
- Substrate
- Semiconductor package
- Thermal conductive bonding layer
- Lid
Potential Applications
- Electronics manufacturing
- Semiconductor industry
- Thermal management systems
Problems Solved
- Preventing coolant from damaging semiconductor packages
- Improving thermal conductivity
- Enhancing device reliability
Benefits
- Increased device lifespan
- Better performance under thermal stress
- Protection against coolant leaks
Original Abstract Submitted
A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.
