18502657. ELECTRONIC DEVICE INCLUDING INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
Contents
ELECTRONIC DEVICE INCLUDING INTERPOSER
Organization Name
Inventor(s)
Soyoung Lee of Gwacheon-si (KR)
ELECTRONIC DEVICE INCLUDING INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18502657 titled 'ELECTRONIC DEVICE INCLUDING INTERPOSER
Simplified Explanation
The abstract describes an electronic device with an interposer that connects a first circuit board with an application processor (AP) to a second circuit board with a communication processor (CP) via a via in the interposer.
- The electronic device includes a first circuit board with a first connection terminal for the AP.
- An interposer with a via connects the first circuit board to a second circuit board with a second connection terminal for the CP.
- The interposer surrounds a portion of the first circuit board and connects the first and second circuit boards.
- The CP is connected to the second connection terminal and an antenna is connected to the CP.
Potential applications of this technology:
- Mobile devices
- Internet of Things (IoT) devices
- Wearable technology
Problems solved by this technology:
- Efficient communication between application and communication processors
- Space-saving design for electronic devices
Benefits of this technology:
- Improved connectivity and communication within electronic devices
- Compact design for smaller and more portable devices
- Enhanced performance and functionality in electronic devices
Original Abstract Submitted
An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.
