18501089. ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)

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ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

Honkai Tomimoto of Tokyo (JP)

Hideki Kawashima of Tokyo (JP)

ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18501089 titled 'ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS

Simplified Explanation

The patent application describes an electronic apparatus with a unique support member for heat dissipation.

  • The electronic apparatus includes a first board with a heat generating element.
  • A second board is supported by a support member, fixed to the first board, and separated by a distance.
  • A heat dissipation member overlaps with the second board and the support member, separated by a distance.
  • The support member has a heat receiving part connected to the heat generating element, a first heat transfer part, and a second heat transfer part.
  • The first heat transfer part transfers heat from the heat receiving part to the heat dissipation member.
  • The second heat transfer part transfers heat from the fixing part to the heat dissipation member.
  • The support member is designed to reduce heat transfer from the heat receiving part to the fixing part.

Potential applications of this technology:

  • Electronic devices requiring efficient heat dissipation.
  • Computers, servers, and other electronic equipment with heat generating components.

Problems solved by this technology:

  • Improves heat dissipation efficiency.
  • Prevents overheating and potential damage to electronic components.

Benefits of this technology:

  • Enhanced reliability and longevity of electronic devices.
  • Improved performance under high temperature conditions.
  • Cost-effective solution for heat management in electronic equipment.


Original Abstract Submitted

An electronic apparatus includes a first board having a heat generating element, a second board, a support member having a fixing part to which the second board is fixed, and which supports the second board so as to overlap with the first board separated by a distance, and a heat dissipation member on an opposite side of the first board across the second board and the support member, so as to overlap with the second board separated by a distance. The support member includes a heat receiving part thermally connected to the heat generating element, a first heat transfer part which transfers heat received by the heat receiving part to the heat dissipation member, and a second heat transfer part which transfers heat received by the fixing part to the heat dissipation member. The support member has a shape which reduces heat transfer from the heat receiving part to the fixing part.