18495857. BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE simplified abstract (DAIKIN INDUSTRIES, LTD.)
Contents
- 1 BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE
Organization Name
Inventor(s)
Akiyoshi Yamauchi of Osaka (JP)
Yosuke Kishikawa of Osaka (JP)
BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18495857 titled 'BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE
Simplified Explanation
The patent application describes a joined article consisting of a resin with a linear expansion coefficient of 17 ppm/°C or higher and a thickness of 5 to 100 μm, joined to a metal with a thickness of 5 to 50 μm. The resin includes a heat-affected layer close to the metal, occupying 80% or less of the resin's thickness. The joined article serves as a dielectric material for a substrate, with the substrate also including a resin stacked on top of the joined article.
- Resin with high linear expansion coefficient (17 ppm/°C or higher)
- Metal joined to resin with specific thickness ranges
- Heat-affected layer in resin close to metal
- Dielectric material for substrate
- Substrate with resin stacked on top of joined article
Potential Applications
The technology could be used in electronic components, circuit boards, and other applications requiring a dielectric material with specific thermal properties.
Problems Solved
This technology solves the problem of mismatched thermal expansion coefficients between materials in electronic components, which can lead to cracking and failure under thermal stress.
Benefits
The joined article provides a stable and reliable interface between the resin and metal, ensuring proper thermal performance and longevity of electronic devices.
Potential Commercial Applications
- Electronic manufacturing
- Aerospace industry
- Automotive industry
Possible Prior Art
One possible prior art could be the use of adhesives or other bonding techniques to join resin and metal in electronic components. However, the specific configuration and properties described in this patent application may be novel and innovative.
Unanswered Questions
How does this technology compare to traditional bonding methods in terms of cost and efficiency?
The article does not provide information on the cost-effectiveness or efficiency of this technology compared to traditional bonding methods.
What specific materials are recommended for the resin and metal in this joined article?
The patent application does not specify the exact materials recommended for the resin and metal, leaving room for further exploration and research in material selection.
Original Abstract Submitted
A joined article including: a resin () having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 μm; and a metal joined to a surface of the resin () and having a thickness of 5 to 50 μm. The resin () includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin () stacked on the joined article.
