18490995. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18490995 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes multiple redistribution structures and bonding pads, as well as a bonding wire and a molding layer. Here are some key points to explain the patent/innovation:
- The semiconductor package consists of a first redistribution structure with a first redistribution layer and bonding pad, and a second redistribution structure with a second redistribution layer and bonding pad.
- The first semiconductor chip is placed on the first redistribution structure, with the second redistribution structure on top of it.
- A bonding wire electrically connects the second redistribution bonding pad to the first redistribution bonding pad.
- A molding layer covers at least a portion of the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.
Potential Applications
The technology described in this patent application could be used in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This technology helps in improving the electrical connections within semiconductor packages, leading to better performance and reliability of the devices.
Benefits
Some benefits of this technology include enhanced electrical connectivity, increased durability, and improved overall functionality of semiconductor packages.
Potential Commercial Applications
This technology could find applications in the consumer electronics industry, automotive sector, telecommunications, and other fields requiring advanced semiconductor devices.
Possible Prior Art
One possible prior art for this technology could be similar semiconductor packaging techniques used in the industry, such as flip chip packaging or wire bonding methods.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison with other semiconductor packaging methods, leaving the reader to wonder about the specific advantages and disadvantages of this technology in relation to existing methods.
What are the specific materials used in the bonding wire and molding layer in this semiconductor package?
The article does not delve into the specific materials used in the bonding wire and molding layer, leaving a gap in understanding the composition and properties of these crucial components in the semiconductor package.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. The semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.
