18490597. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing flexible wiring board designs in terms of signal transmission efficiency and interference reduction?
- 1.9.3 What manufacturing processes are required to produce the flexible wiring board with the unique electroconductive layer described in the patent application?
- 1.10 Original Abstract Submitted
FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
TOSHIYUKI Yoshida of Kanagawa (JP)
FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18490597 titled 'FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
Simplified Explanation
The flexible wiring board described in the patent application includes a signal line and an electroconductive layer with a unique structure. Here are some key points to note:
- Signal line transmits a signal
- Electroconductive layer faces the signal line
- Electroconductive layer has a first portion with openings and a linear second portion within one of the openings
- Second portion has a connection portion at one end and an open end at the other
- Connection portion is on the sending side of the signal transmission direction
- Angle between signal transmission direction and second portion is acute or obtuse
Potential Applications
The technology described in the patent application could be used in various electronic devices and systems that require flexible wiring boards with improved signal transmission capabilities.
Problems Solved
This innovation addresses the challenge of maintaining signal integrity and reducing interference in flexible wiring boards, especially in applications where space is limited.
Benefits
- Improved signal transmission efficiency - Reduced signal interference - Enhanced flexibility and durability of wiring boards
Potential Commercial Applications
The technology could be applied in industries such as consumer electronics, automotive, aerospace, and telecommunications for the development of advanced electronic devices and systems.
Possible Prior Art
One possible prior art could be the use of traditional flexible wiring boards with simple conductor layouts, which may not offer the same level of signal transmission efficiency and interference reduction as the innovative design described in the patent application.
Unanswered Questions
How does this technology compare to existing flexible wiring board designs in terms of signal transmission efficiency and interference reduction?
The article does not provide a direct comparison with existing flexible wiring board designs, so it is unclear how this technology stacks up against current solutions in the market.
What manufacturing processes are required to produce the flexible wiring board with the unique electroconductive layer described in the patent application?
The patent abstract does not delve into the specific manufacturing processes involved in producing the flexible wiring board, leaving a gap in understanding the practical implementation of this technology.
Original Abstract Submitted
A flexible wiring board includes a signal line that transmits a signal and an electroconductive layer that is disposed to face the signal line, wherein the electroconductive layer includes a first portion in which a plurality of openings are provided, and a linear second portion that is formed in at least one of the plurality of openings, that has, at one end thereof, a connection portion connected to the first portion, and whose other end is an open end, where the connection portion is disposed in the second portion on a sending side in a transmission direction of a signal through the signal line. An angle between a direction along the transmission direction of the signal and an extension direction of the second portion from the connection portion toward the open end is an acute angle or an obtuse angle.
