18490449. SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION simplified abstract (QUALCOMM Incorporated)

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SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION

Organization Name

QUALCOMM Incorporated

Inventor(s)

Rui Tang of Santa Clara CA (US)

Chenqian Gan of Cambridge (CN)

Zhongning Liu of San Diego CA (US)

SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18490449 titled 'SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION

Simplified Explanation

The abstract describes a substrate that contains a dielectric layer and an inductive coupler. The inductive coupler consists of a first inductor and a second inductor, both formed within the dielectric layer. The first inductor is electrically connected to a transmitter filter and an antenna, while the second inductor is connected to the transmitter filter and ground. The second inductor serves as a pathway to ground for a rejected signal with a rejected frequency. When the rejected signal passes through the second inductor, it induces a signal in the first inductor that counteracts a leakage signal traveling through the transmission filter.

  • The substrate includes a dielectric layer and an inductive coupler.
  • The inductive coupler consists of a first inductor and a second inductor.
  • The first inductor is connected to a transmitter filter and an antenna.
  • The second inductor is connected to the transmitter filter and ground.
  • The second inductor provides a pathway to ground for a rejected signal with a rejected frequency.
  • The rejected signal passing through the second inductor induces a signal in the first inductor.
  • The induced signal in the first inductor counteracts a leakage signal in the transmission filter.

Potential applications of this technology:

  • Wireless communication systems
  • Radio frequency (RF) circuits
  • Antenna systems
  • Transmitter filters

Problems solved by this technology:

  • Minimizing leakage signals in transmission filters
  • Improving signal quality in wireless communication systems
  • Reducing interference in RF circuits

Benefits of this technology:

  • Enhanced signal integrity
  • Improved overall system performance
  • Reduced interference and noise
  • Increased efficiency in wireless communication systems


Original Abstract Submitted

A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be electrically coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be electrically coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.

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